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DTSTART;TZID=America/Los_Angeles:20260715T080000
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DTSTAMP:20260616T191604
CREATED:20260616T203422Z
LAST-MODIFIED:20260616T203422Z
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SUMMARY:Advanced Packaging Summit 2026
DESCRIPTION:Advanced Packaging Summit 2026\, under the theme “Packaging the Future of AI – From Silicon to Photon\,” will examine the evolution of packaging technologies in the AI era and their broader implications for the semiconductor industry. Featuring presentations by leading industry experts\, the summit will explore market shifts driven by the growing demand for AI semiconductors\, along with key technologies enabling advanced packaging. The program will also highlight the innovation journey from silicon-based integration technologies to photonics-based interconnects\, which are essential to enhancing packaging productivity and scalability. Panel discussions in each session will further provide opportunities to exchange insights on real-world applications\, technical challenges\, and possibilities for cross-industry collaboration\, while exploring new business opportunities and strategic perspectives created by advanced packaging technologies in the AI era. \nREGISTER HERE
URL:https://semiwiki.com/event/advanced-packaging-summit-2026/
LOCATION:Suwon Convention Center\, Suwon Convention Center\, 140 Gwanggyojungang-ro\, Yeongtong-gu\, Suwon-si\, Gyeonggi-do\, Korea\, Republic of
ATTACH;FMTTYPE=image/webp:https://semiwiki.com/wp-content/uploads/2026/06/APS_web-square_0.jpg.webp
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