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SUMMARY:IEEE International Conference on PHYSICAL ASSURANCE and INSPECTION of ELECTRONICS (PAINE)
DESCRIPTION:ABOUT PAINE\n\n\n\n\nPhysical inspection of electronics has grown significantly over the past decade and is becoming a major focus for the chip designers\, original equipment manufacturers\, and system developers. The complex long life of the electronic devices coupled with their diverse applications is making them increasingly vulnerable to various forms of threats and inspection. Large industry and government efforts have been put in place across the globe to address related supply chain security problems to offer solutions\, training\, and services. The number of programs introduced by the US government has increased over the years to analyze and develop relevant solutions. Although much focus is given to the digital domain\, physical assurance and inspection of electronics as well as physical fingerprinting based on analog parameters are rapidly providing opportunities for unique countermeasures. \nPAINE conference provides a unique venue for all researchers and practitioners from academia\, industry\, and government to have productive dialog on such topics. Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements. PAINE covers the broad topic of hardware security and trust; example topics of interest include but are not limited to: \n\n\n\n\n\n\n\n\n\nTopics to be Covered:\n\n\nNew metrologies for characterization and assurance\nAdvanced packaging and heterogeneous integration\nEmerging topics in physical inspection and assurance\nImage analysis and artificial intelligence for assurance and inspection\nMetrologies characterization\nAutomated inspection and metrology for advanced packaging\nSecurity primitives: Novel devices\, materials\, and systems\nTest vehicles and performance quantification\nAdditive manufacturing assurance for electronics\nPhysical and design interface assurance\nTrojans and backdoors: Detection and prevention\n\n\nWorkforce Development\nFault injection assessment and countermeasures\nSide channel assessment (power\, timing\, EM)\nAnalog & mixed-signal circuits and systems security\nFPGA Bitstream protection and vulnerabilities\nCounterfeit Detection and Anti-Counterfeit Technique\nNovel material and devices for assurance\nSample Preparation\nPCB trust and assurance\nChip and PCB level decomposition for assurance\nFIB/SEM for assurance\n\n\nElectro-optical probing using PEM\, EOP\, EOFM\, etc.\nPhysical/side channel fingerprinting\nMod-chip on PCB\nMicroprobing and nanoprobing\nBus-snooping\nField-based weakness\nCountermeasures against tampering and decomposition\nFunctionality validation\nProcess improvements\nFailure analysis and fault isolation\nPhysical/logical shielding etc.\nPhotonics Assurance\n\nREGISTER  HERE
URL:https://semiwiki.com/event/ieee-international-conference-on-physical-assurance-and-inspection-of-electronics-paine/
LOCATION:Phoenix\, AZ\, Phoenix\, AZ\, United States
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