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DTSTART;VALUE=DATE:20260122
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UID:361015-1769040000-1769212799@semiwiki.com
SUMMARY:IEEE Hybrid Bonding Symposium
DESCRIPTION:January 22-23\, 2026\, hosted by SEMI International\, Silicon Valley\, CA USA \nNote: HBS’26 is a hybrid event\, with both in-person and virtual participation via WebEx. \nDownload the Call for Presentations! \nHybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance\, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design\, performance characterization\, thermal management and reliability are also important considerations to enable applications in various areas. \nReview the HBS’25 Program\, and watch videos of most of the presentations.\nPost-Symposium Report on the 2025 Hybrid Bonding Symposium \nREGISTER HERE
URL:https://semiwiki.com/event/ieee-hybrid-bonding-symposium/
LOCATION:SEMI HQ\, SEMI HQ\, 673 S Milpitas Blvd.\, Milpitas\, CA\, 95035\, United States
ATTACH;FMTTYPE=image/jpeg:https://semiwiki.com/wp-content/uploads/2025/08/1753295854533.jpg
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