BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//SemiWiki - ECPv6.15.18//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://semiwiki.com
X-WR-CALDESC:Events for SemiWiki
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Los_Angeles
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20250309T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20251102T090000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20260308T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20261101T090000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20270314T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20271107T090000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260430T090000
DTEND;TZID=America/Los_Angeles:20260430T100000
DTSTAMP:20260408T200502
CREATED:20260408T195314Z
LAST-MODIFIED:20260408T195314Z
UID:368236-1777539600-1777543200@semiwiki.com
SUMMARY:Webinar: Powering 3D Multi-Die Designs with RedHawk-SC Electrothermal
DESCRIPTION:As semiconductors continue to scale\, designers are turning to 3DIC architectures to meet increasing demands for performance\, energy efficiency\, and functional density in data centers and edge AI applications. However\, stacking multiple dies introduces new multiphysics challenges including electrical\, structural\, and thermal issues. Join this webinar to learn how RedHawk-SC Electrothermal enables designers to analyze the multiphysics behavior of chips all at once in complex multi-die designs. \nTogether\, Synopsys and Ansys\, part of Synopsys\, provide engineers a comprehensive flow that offers in-design analysis along with final signoff\, enabling faster and more confident development of next-generation multi-die designs. \nAttend this webinar to:  \n\nEnhance your understanding of RedHawk-SC Electrothermal as a foundry-certified multiphysics integrity tool for multi-die designs\nLearn about new features and flow capabilities for 2.5D/3D thermal and mechanical analysis\, including GPU acceleration and ML-based solver\nIntegration of multiphysics simulation in Synopsys implementation and signoff solutions\n\n\n\n\n\nFeatured Speaker\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nDr. Lang Lin \nProduct Management\, Principal \nDr. Lang Lin\, Product Management\, Principal \nBio: Dr. Lang Lin is a technology leader at Synopsys Inc.\, where he directs product strategy for EDA solutions that ensure the multiphysics integrity\, reliability\, and security of advanced IC and multi die systems. With a Ph.D. in Electrical and Computer Engineering from the University of Massachusetts\, his background spans low power design\, multi-die design\, and hardware security—areas that continue to influence his work at the intersection of multiphysics modeling and secure silicon design. Dr. Lin has co authored over 40 papers and patents\, and his work has been recognized with top honors including IEEE HOST Best Paper Award\, IEEE DAC Best Paper Award\, and the Ansys CEO Innovation Award. He worked for Intel and Ansys before his product management role at Synopsys. \nProfile: Lang Lin | Synopsys \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nREGISTER HERE
URL:https://semiwiki.com/event/webinar-powering-3d-multi-die-designs-with-redhawk-sc-electrothermal/
LOCATION:Online
ATTACH;FMTTYPE=image/jpeg:https://semiwiki.com/wp-content/uploads/2026/04/Synopsys-RedHawk-SC-Electrothermal-3DIC-webinar-1200x1200px-v1A-2.jpg
END:VEVENT
END:VCALENDAR