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SUMMARY:ChipEx2026
DESCRIPTION:The major annual event of the Israeli semiconductor industry \nChipEx2026\, the largest annual event of the Israeli semiconductor industry\, will be held on May 12-13\, 2026 in Tel Aviv\, Israel. ChipEx2026 showcases companies including manufacturers\, developers and suppliers of advanced hardware technologies & services. It also includes a technical seminar where the world’s leading experts address the industry’s most relevant issues. \nThe event is produced by ASG Ltd. in cooperation with SIA\, Semiconductor Industry Association and with Semi\, the largest global industry association. \nThe goal of ChipEx2026 is to update all professionals involved with the Israeli semiconductor industry with the latest technological innovations and future directions of the industry. \nChipEx2026 target audience are all people involved with the semiconductor industry including engineers\, R&D managers\, industry experts\, senior executives in microelectronics related companies\, multinational design centers\, consultants\, venture capital managers as well as electrical/electronic/computer science students & professors from the various universities around Israel. \nChipEx2026 consists of three main parts: \nVendors’ Exhibition \nThe ChipEx exhibition includes booths in various sizes for presentations and demonstrations of new design and development tools. This year\, the ChipEx2026 exhibition will take place on May 12\, 2026 at the Tel-Aviv Expo Center and will include industry vendors\, service providers\, and manufacturers of electronic design tools\, components and manufacturing equipment from Israel and around the globe. These exhibitors will exhibit and update the visitors with the latest developments in tools and services for the semiconductor industry. \nTechnical Seminar \nTechnical lectures given by industry experts\, senior executives from the semiconductor industry\, vendors\, and university professors. The format of the sessions intends to cultivate and promote an instructive and productive interchange of ideas and solutions among industry developers and designers. The lectures are divided to various tracks in separate halls and address the major topics related to the microelectronics industry. This year\, the ChipEx2026 technical seminar will take place on May 12\, 2026 at the Tel-Aviv Expo Center. \nChipEx2026 Executive Summit \nThe Clossing session of ChipEx2026 will take place on May 13\, 2026 at Peres Center for Peace and Innovation and will include top industry figures and will act as the Executive summit of ChipEx2026 targeting Industry leaders and top executives from Israel and around the globe. \nChipEx2026 is a great opportunity for any industry vendor or service provider to meet its target audience as well as interact with the decision makers in the various Israeli semiconductor companies. \nWe invite you to take part in ChipEx2026 as an exhibitor\, a speaker and/or as a sponsor. \nFor more details please contact us at:\nPhone: +972-9-7454007\nFax: +972-9-7748858\ninfo@chiportal.co.il\nwww.chipex.co.il \nREGISTER HERE
URL:https://semiwiki.com/event/chipex2026/
LOCATION:Tel Aviv\, Israel\, Tel Aviv\, Israel
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SUMMARY:Webinar: Cutting Full-Chip SoC Debug from Days to Minutes with AI
DESCRIPTION:*Company Email Required for Registration* \nFull-chip SoC debug has become one of the most expensive bottlenecks in modern verification. A single production issue can pull multiple engineers away days as they chase a failure through waveforms\, logs\, and across hundreds of thousands of lines of code. \nIn this webinar\, we will demonstrate how the Bronco AI Debug Agent performs root-cause analysis (RCA) on real production issues in under 15 minutes\, with a 70% success rate on customer regressions. You will see the agent operate end-to-end on a representative full-chip SoC\, from a failing regression to an annotated root cause\, while interoperating with customer’s standard commercial EDA flows. \nWhat we will cover: \n– Live demonstration of the Debug Agent on a full-chip SoC regression failure\n– How the agent navigates massive codebases\, logs\, and waveforms to isolate failure mechanisms\n– Deployment patterns at large public chip companies and as well as fast-moving startups\n– How bring-your-own-model and on-prem deployment keep customer IP inside your environment.\n– How Bronco gets better without ever training on customer data. \nWho should attend: \n– DV engineers and managers responsible for regression triage and production debug\n– SoC verification leads evaluating AI-native tooling for their flows\n– VPs of Engineering and Silicon leaders tracking DV cycle time and engineering ROI\n– Security and infrastructure owners assessing on-prem AI deployment for chip design \nSpeaker: \nDavid Zhi LuoZhang\, Co-Founder and CEO of Bronco AI\, will walk through the live demonstration on a real design and take questions how customers deploy\, evaluate\, and scale Bronco within their silicon projects. David works tightly with customers to deploy Bronco and coordinates between the core R&D\, customer\, and industry-relations teams at Bronco. \n*This webinar is in partnership with SemiWiki and Bronco AI* \nREGISTER HERE
URL:https://semiwiki.com/event/webinar-cutting-full-chip-soc-debug-from-days-to-minutes-with-ai/
LOCATION:Online
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