Webinar: Implementing DFT in 2.5/3D designs using Tessent Multi-die software
OnlineNext-generation devices increasingly feature complex architectures that connect dies vertically (3D IC) or side-by-side (2.5D) so they behave as a single device. The new Tessent Multi-die software delivers comprehensive automation for the highly complex DFT tasks associated with these 2.5D and 3D IC designs. Tessent Multi-die software automates the generation and insertion of IEEE 1838 …
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