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DTSTART;TZID=America/Los_Angeles:20260128T090000
DTEND;TZID=America/Los_Angeles:20260128T170000
DTSTAMP:20260424T030410
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SUMMARY:Power Seminar - Burnaby
DESCRIPTION:About this event\nAs power levels rise and systems scale\, high-power testing becomes more complex and time-consuming. This hands-on Power Solutions Seminar focuses on practical test strategies for batteries\, fuel cells\, green energy\, and power conversion. \nYou will experience expert-led technical sessions with hands-on\, real-world application insights. Explore Keysight’s three new High-Power ATE System Supplies and demos across our power portfolio to improve test efficiency\, accuracy\, and development speed. \n\n\n\n\n\n\n\nWho should attend this event?\nThis event is designed for development engineers in power electronics\, battery systems\, and green energy. \n\n\n\nREGISTER HERE
URL:https://semiwiki.com/event/power-seminar-burnaby/
LOCATION:Burnaby\, BC\, Burnaby\, British Columbia\, Canada
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2026/01/Screenshot-2026-01-12-202823.png
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DTSTART;VALUE=DATE:20260128
DTEND;VALUE=DATE:20260129
DTSTAMP:20260424T030410
CREATED:20260113T043124Z
LAST-MODIFIED:20260113T043124Z
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SUMMARY:Webinar: Powering the Future: Megawatt Charging Solutions for Heavy-Duty Electrification
DESCRIPTION:About this event\nJoin our upcoming webinar to discover how Keysight is powering the future of heavy-duty electric transportation with advanced megawatt-charging test solutions. \nLearn how to validate ultra-high-power delivery beyond 3 MW\, ensure compliance with MCS and ISO 15118-20\, and streamline interoperability testing\, all within a single\, fully controllable platform designed for both compliance and development debugging. \nWe’ll explore how seamless integration of software\, hardware\, and project services accelerates the deployment of safe\, scalable\, and standards-driven charging infrastructure for trucks\, ships\, and heavy machinery. \n\n\n\n\n\n\n\nWho should attend this event?\nThose involved in the shift towards a future-proven transportation\, logistics\, and construction ecosystem. Specific titles: OEM Electrification Leaders; EVSE Manufacturers & Charging Infrastructure Developers; Compliance & Standards Specialists; Fleet Electrification Managers: Grid Integration & Energy Management Specialists. \n\n\n\nREGISTER HERE
URL:https://semiwiki.com/event/webinar-powering-the-future-megawatt-charging-solutions-for-heavy-duty-electrification/
LOCATION:Virtual
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2026/01/Screenshot-2026-01-12-203022.png
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DTSTART;TZID=America/Los_Angeles:20260127T090000
DTEND;TZID=America/Los_Angeles:20260127T100000
DTSTAMP:20260424T030410
CREATED:20251217T021629Z
LAST-MODIFIED:20251217T021629Z
UID:364770-1769504400-1769508000@semiwiki.com
SUMMARY:Webinar: Solving Timing closure challenges using Gencellicon (previously Excellicon)
DESCRIPTION:Timing closure is one of the most challenging aspects of ASIC design. While traditionally seen as a backend process\, its resolution begins at the architectural level and extends through the implementation stages. This webinar examines the key obstacles designers encounter and demonstrates how our timing closure solutions deliver comprehensive support throughout the entire design process. \nWhat you will learn \n\nThe breadth of the entire Gencellicon portfolio\nHow timing closure solutions can alleviate your design process using Siemens tools\n\nWho should attend \n\nImplementation engineers\nSoC architects\nDesign Verification teams\nTest engineers\nPower architects\nPhysical designers\n\n\n\n\nSpeaker: \n\n\n\n\nHimanshu Bhatnagar \nSenior Director\, Siemens EDA \n\n\n\nHimanshu brings over 20 years of expertise in chip design\, having developed complex SoCs across networking\, communications\, imaging\, and other domains. His extensive experience in SoC realization led to the publication of two books: Advanced ASIC Chip Synthesis\, a practical guide to synthesis and static timing analysis. Before founding Excellicon\, now Gencellicon\, Himanshu held key positions at leading semiconductor companies\, including Mindspeed Technologies\, Conexant Systems\, and ST Microelectronics. At Conexant Systems\, he oversaw global implementation efforts and played a pivotal role in establishing multiple design centers in India and China. Additionally\, Himanshu has served as an advisor to various EDA companies. \n\n\n\n\n\nREGISTER HERE
URL:https://semiwiki.com/event/webinar-solving-timing-closure-challenges-using-gencellicon-previously-excellicon/
LOCATION:Online
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2025/12/Screenshot-2025-12-16-181547.png
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DTSTART;TZID=America/Los_Angeles:20260127T083000
DTEND;TZID=America/Los_Angeles:20260127T170000
DTSTAMP:20260424T030410
CREATED:20260107T031557Z
LAST-MODIFIED:20260107T031557Z
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SUMMARY:Semiconductor Traceability and Provenance Workshop
DESCRIPTION:The National Institute of Standards and Technology (NIST) will host the Semiconductor Traceability and Provenance Workshop on Tuesday\, January 27\, 2026\, at the NIST National Cybersecurity Center of Excellence (NCCoE) conference facility\, in Rockville\, Maryland. This in-person\, one-day event builds on the momentum from the April 2025 workshop on Trust and Provenance in the Semiconductor Supply Chain\, which identified traceability as the top priority of semiconductor industry stakeholders. \nAs semiconductor devices grow more complex and globally distributed\, the risks from counterfeit components\, malicious tampering\, and opaque sourcing threaten the security\, reliability\, and resilience of critical systems. Strengthening traceability and provenance is essential to mitigating supply chain threats\, supporting national security imperatives\, and addressing the grand challenges in secure microelectronics (https://nvlpubs.nist.gov/nistpubs/CHIPS/NIST.CHIPS.1000.pdf). \nThe workshop will convene technical leaders across the semiconductor ecosystem (e.g.\, hyperscalers\, auto and semiconductor companies\, federal agencies\, academia) to address the practical challenges and opportunities for implementing traceability in semiconductor chips. This one-day event will feature plenary\, panel\, and interactive breakout sessions. Participants will be encouraged to collaborate and discuss key questions and topics that will identify short-term (<1 year) and longer-term (2028-2029 time frame) activities related to semiconductor traceability and provenance. The topics that will be considered include but are not limited to: \n\nExisting solutions\nTechnical\, operational challenges to traceability adoption\nOpportunities for public-private collaboration (e.g.\, hyperscalers\, automobile\,\nsemiconductor companies\, government agencies\, academia)\nRoadblocks to alignment and paths to overcoming them\nEconomic drivers and pilot use cases for traceability\nFrameworks for joint standards development and implementation\nRoadmap for collaboration and path to success\n\n\nOutcomes from the workshop will include a published roadmap and post-workshop report that advances shared goals in securing semiconductor supply chains. \nRegistration Info\nThe registration fee for this event is $97.00 and includes AM/PM breaks and lunch. \nRegistration closes on Tuesday\, January 20\, 2026. \nRegistration Contact for Additional Information or Questions:\nCarol L. Shibley\ncarol.shibley@nist.gov\n(301) 975-8302 \nTECHNICAL CONTACT:\nKostas Amberiadis\nkostas.amberiadis@nist.gov \nREGISTER HERE
URL:https://semiwiki.com/event/semiconductor-traceability-and-provenance-workshop-2/
LOCATION:NIST’s National Cybersecurity Center of Excellence (NCCoE)\, 9700 Great Seneca Highway\, Rockville\, MD\, 20850\, United States
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DTSTART;VALUE=DATE:20260122
DTEND;VALUE=DATE:20260124
DTSTAMP:20260424T030410
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SUMMARY:IEEE Hybrid Bonding Symposium
DESCRIPTION:January 22-23\, 2026\, hosted by SEMI International\, Silicon Valley\, CA USA \nNote: HBS’26 is a hybrid event\, with both in-person and virtual participation via WebEx. \nDownload the Call for Presentations! \nHybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance\, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design\, performance characterization\, thermal management and reliability are also important considerations to enable applications in various areas. \nReview the HBS’25 Program\, and watch videos of most of the presentations.\nPost-Symposium Report on the 2025 Hybrid Bonding Symposium \nREGISTER HERE
URL:https://semiwiki.com/event/ieee-hybrid-bonding-symposium/
LOCATION:SEMI HQ\, SEMI HQ\, 673 S Milpitas Blvd.\, Milpitas\, CA\, 95035\, United States
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