Semitracks Course: EOS, ESD and How to Differentiate
2026-03-16 - 2026-03-17 | Munich, Germany, Munich, Germany
Electrical Overstress (EOS) and Electrostatic Discharge (ESD) account for most of the field failures observed in the electronics industry. Although EOS and ESD damage can at times look quite similar to each other, the source each and the solution can be quite different. Therefore, it is important to be able to distinguish between the two mechanisms. The semiconductor industry needs knowledgeable engineers and scientists to understand these issues. EOS, ESD and How to Differentiate is a 2-day course that offers detailed instruction on EOS, ESD and how to distinguish between them. This course is designed for every manager, engineer, and technician concerned with EOS, ESD, analyzing field returns, determining impact, and developing mitigation techniques.

What Will I Learn By Taking This Class?
Participants will learn to develop the skills to determine what constitutes good EOS and ESD design, how to recognize devices that can reduce EOS and ESD susceptibility, and how to design new EOS and ESD structures for a variety of technologies. This skill-building series is divided into five segments:

Overview of the EOS Failure Mechanism. Participants will learn the fundamentals of EOS, the physics behind overstress conditions, sources of EOS, test equipment, and the results of failure.
Overview of the ESD Failure Mechanism. Participants will learn the fundamentals of ESD, the physics behind static generation and discharge, test equipment, test protocols, and the results of failure.
ESD Circuit Design Issues. Participants will learn how designers develop circuits to protect against ESD damage. This includes MOSFETs, diodes, off-chip driver circuits, receiver circuits, and power clamps.
How to Differentiate. Participants will learn how to tell the difference between EOS and ESD. They will learn how to simulate damage and interpret pulse widths, amplitudes and polarity.
Resolving EOS and ESD on the Manufacturing Floor. Participants will see a number of common problems and their origins.

Course Objectives

This course will provide participants with an in-depth understanding of electrical overstress, the models used for EOS, and the manifestation of the mechanism.
Participants will be able to understand the ESD failure mechanism, test structures, equipment, and testing methods used to achieve robust ESD resistance in today’s components.
This course will identify the major issues associated with ESD, explain how they occur, how they are modeled, and how they are mitigated.
Participants will be able to identify basic ESD structures and how they are used to help reduce ESD susceptibility on semiconductor devices.
Participants will be able to distinguish between EOS and ESD when performing a failure analysis.
Participants will be able to estimate a pulse width, pulse amplitude, and determine the polarity of an EOS or ESD event.
Participants will see examples of common problems that result in EOS and ESD in the manufacturing environment.

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IRPS 2026
2026-03-22 - 2026-03-26 | Loews Ventana Canyon Resort, Loews Ventana Canyon Resort, 7000 N Resort Dr, Tuscon, AZ, 85750, United States
About IRPS
For over 60 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world, IRPS seeks to understand the reliability of semiconductor devices, integrated circuits, and microelectronic systems through an improved understanding of both the physics of failure as well as the application environment.
IRPS provides numerous opportunities for attendees to increase their knowledge and understanding of all aspects of microelectronics reliability. It is also an outstanding chance to meet and network with reliability colleagues from around the world.
IRPS 2026 focus topics:

New materials: 2D transition metal dichalcogenides (TMDs), (semi)conducting oxides (IGZO, ITO, IWO, InOx, others), (anti)ferroelectrics, low-k dielectrics, reliability of capacitors, junctions, FETs
3D packaging and heterogeneous integration: Reliability of 3D, enhanced 2D, chiplets, Si bridge, interposer, RDL technology, hybrid bonding, micro-bump, Cu-pillar and other interconnects
Data Center Reliability: Emerging trends in Reliability/Availability/Serviceability, silent data corruption, reliability at scale, AI and HPC workloads, On-chip telemetry, thermals, SER

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MSEC 2026
2026-03-31 - 2026-04-02 | Hyatt Regency Boston / Cambridge, Hyatt Regency Boston / Cambridge, 575 Memorial Dr, Cambridge, MA, 02139, United States
SENSORIZATION: ENABLING A NEW INTELLIGENCE
The MEMS and Sensors Executive Conference 2024 is designed for senior executives across the MEMS and sensors supply chain and adjacent industries. Industry economic, business updates will be covered from different aspects of the ecosystem, together with forward-looking strategic and technology trends. The opportunities and challenges brought about by key technologies in bio-medical/MEMS healthcare, generative AI, positioning navigation and timing and sustainability will be explored. The growth in existing and emerging MEMS and sensors markets, together with the resulting new components, software, and systems needs, will also be discussed. The usual networking and deal making opportunities will be a key feature as usual.
Get a deep dive on—

Bio-Medical/MEMS Healthcare
Generative AI
Positioning, Navigation and Timing
Automotive
Testing
Machine Learning ML
Sustainability (smart buildings, spaces, cities, and agriculture)

WHO SHOULD ATTEND?
CEO ● Chairmen ● Presidents ● Senior Executives ● Executive Vice Presidents ● CTO ● Startup Founders ● Financial Analysts ● Market Researchers ● Consulting Firms
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SPIE Photonics Europe 2026
2026-04-12 - 2026-04-16 | Palais de la Musique et des Congrès, Palais de la Musique et des Congrès, Place de Bordeaux, Strasbourg, 67082, France
Make plans to share your work with other experts in April 2026

Present your research at the only cross-disciplinary event highlighting compelling optics and photonics technologies—from digital optics to quantum technologies to optical imaging, sensing, and metrology. Additional topics include THz photonics, 3D printed optics, photonic glasses, photosensitive materials, and biophotonics.
Call for papers is now open
SPIE Optical Systems Design is again co-located at SPIE Photonics Europe.

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DATE 2026
2026-04-20 - 2026-04-22 | Palazzo della Gran Guardia, Palazzo della Gran Guardia, Piazza Brà, Verona, 37121, Italy
Design, Automation and Test in Europe Conference |
The European Event for Electronic System Design & Test
Call for Papers

The DATE conference is the main European event bringing together designers and design automation users, researchers and vendors, as well as specialists in hardware and software design, test, and manufacturing of electronic circuits and systems. DATE places a strong emphasis on both technology and systems, covering ICs/SoCs, reconfigurable hardware, and embedded systems, as well as embedded software.
The three-day event consists of a conference with regular papers, extended abstracts, and late breaking results, complemented by timely keynotes, special days, focus sessions, embedded tutorials, half-day workshops, and multi-partner project sessions. The event will also host the Young People Programme fostering networking and exchanges of information on relevant issues, recent research outcomes, and career opportunities for junior researchers. Poster-supported live interactions and pre-recorded videos are available to complement all research paper presentations before, during, and after the conference.
DATE 2026 is the 29th edition of an event that has always been the place for researchers, young professionals, and industrial partners to meet, present their research, and discuss current developments and upcoming trends, with high emphasis on social interaction.
Conference Scope
The conference addresses all aspects of research into technologies for electronic and systems engineering. It covers the design process, test, and tools for design automation of electronic products, ranging from integrated circuits to distributed large-scale systems. This domain includes both hardware and embedded software design issues. The conference scope also includes the specification of design requirements and new architectures for challenging application fields such as sustainable computing, smart societies and digital wellness, secure systems, autonomous systems and smart industry, and state-of-the-art applications of artificial intelligence. Engineers, scientists, and researchers involved in innovative industrial designs are particularly encouraged to submit papers to foster feedback ranging from design to research aspects.
Conference Sponsors
The event is sponsored by the European Design and Automation Association (EDAA), the Electronic System Design Alliance (ESDA), the IEEE Council on Electronic Design Automation (IEEE CEDA) and the ACM Special Interest Group on Design Automation (ACM SIGDA).
In cooperation with IEEE Computer Society Test Technology Technical Community (TTTC), IEEE Solid-State Circuits Society (SSCS) and IEEE Computer Society (IEEE CS).
Conference Committees
The conference leverages the support of multiple committees to support its organisation. The DATE Sponsors Committee supervises the overall structure and operations of the conference; the Executive Committee designs and implement the yearly programme of the conference, and the Technical Programme Committee is dedicated to develop reviews and select the research manuscripts to be published at the conference.

DATE Sponsors Committee (DSC)
DATE Executive Committee (DEC)
Technical Programme Committee (TPC)

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Embedded Vision Summit 2026
2026-05-11 - 2026-05-13 | Santa Clara Convention Center, Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, CA, United States
The premier conference for innovators incorporating computer vision and AI in products
The 2025 Summit has now concluded. Join us May 11-13, 2026!

Attend an Immersive Experience

At the premier conference for innovators incorporating computer vision and AI into products

Join 1,400+ product and application developers, business leaders, investors and customers—all focused on perceptual AI at the edge.
Special features and Summit themes include:

80+ sessions on embedded vision and deep learning techniques, technologies, tools and opportunities, including formats like: presentations, case studies and panel discussions
Multiple expert sessions on deep learning for vision, 3D perception and low-power vision implementation and much more
Keynote presentations by industry luminaries
Four tracks tailored for engineers and business executives, newcomers and experts
Practical sessions to help you create visually intelligent products and gain know-how about computer vision
Edge AI Deep Dive Day filled with in-depth learning from top technology suppliers
An intensive three-hour training session designed to introduce the latest techniques in vision-language models (VLMs) and their integration with traditional computer vision methods
Case studies from leading innovators
Learn from fast-paced panel discussions presenting an array of viewpoints
Ability to see technology in action with live demos of the latest enabling technologies and dig deep into the practical applications and techniques of computer vision and AI

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ASMC 2026
2026-05-11 - 2026-05-14 | Hilton Albany, 40 Lodge St, Albany, NY, 12207, United States
ASMC brings together manufacturers, equipment and materials suppliers, and academia to solve manufacturing challenges with innovative strategies and methodologies.

View the 2025 Agenda

Advancing Semiconductor Manufacturing Excellence
ASMC is the leading international technical conference for discussing solutions that improve the collective manufacturing expertise of the semiconductor industry. Solving the challenges presented by semiconductor manufacturing is a combined effort by device makers, equipment and materials suppliers, and academics. ASMC provides an unparalleled platform for semiconductor professionals to network and learn the latest in the practical application of advanced manufacturing strategies and methodologies. Technical presentations at ASMC highlight industry innovations with specific results and select ASMC manuscripts are published in the ASMC Special Section of IEEE Transactions on Semiconductor Manufacturing.
The ASMC Committee is composed of industry professionals representing the microelectronics supply chain. All papers presented at the conference are peer-reviewed by the ASMC Technical Committee.
WHO SHOULD ATTEND

Academia
Chief Technology Officers
Fab Managers
Equipment Manufacturers
IC Manufacturers
Materials Suppliers
Operations Managers
Process Engineers
Product Managers
Technical Experts

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DVCon China 2026
2026-05-13 08:00 - 17:00 (America/Los_Angeles) | Shanghai Renaissance Pudong Hotel, Renaissance Shanghai Pudong, 719 Yingchun Rd,, Pudong, Shanghai, 201204, China
Hello everyone! Welcome to the 2026 DvCon China Conference! As the chair of this conference, l am truly honored to be here with all of you. lt’s exciting to gather together and discuss the latest trends and cutting-edge technologies in the field of design verification.
In recent years, we’ve seen tremendous growth in China’s chip development across various sectors, particularly in critical areas like CPUs, GPUs, artificial intelligence, automotive electronics, communications, and the Internet of Things (loT). lt’s inspiring to witness the rapid rise of domestic companies in these fields, which not only drives technological advancement but also enhances our overall market competitiveness.
About DVCon China
DVCon China is a technical conference in China targeting the application of standardized languages, tools, and methodologies for the design and verification of electronic systems and integrated circuits. Hosted by Accellera Systems Initiative, the format of DVCon China is similar to the successful DVCon United States conference held for over 20 years in the Silicon Valley.
In order to boost the interest, usage and development of electronic design automation (EDA) and intellectual property (IP) standards in China, this highly technical conference is organized to invite industry experts to learn and share best practices on:
1. The application of system-level design and verification languages such as SystemC, SystemVerilog or e 2.The use of SystemVerilog Assertions (SVA) or the Property Specification Language (PSL) 3.Verification methodologies based on the Universal Verification Methodology (UVM)
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VOICE 2026
2026-05-18 - 2026-05-20 | Scottsdale, Arizona, Scottsdale, AZ, United States
VOICE is a developer conference, created by test engineers for test engineers.

Each year, the VOICE Developer Conference unites semiconductor test professionals representing the world’s leading integrated device manufacturers (IDMs), foundries, fabless semiconductor companies and outsourced semiconductor assembly and test (OSAT) providers to exchange information about the latest technology advancements, express new ideas, share best practices and network with one another.

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COMPUTEX Taipei 2026
2026-06-02 - 2026-06-05 | Taipei Nangang Exhibition Center, Taipei Nangang Exhibition Center, No. 1, Jingmao 2nd Rd, Taipei City, Nangang District, 115, Taiwan
Main Themes
COMPUTEX is a leading global exhibition focused on AIoT and startups.
The expo will continue with the position of “AI Next”,
featuring the latest tech trends: AI & Robotics, Next-Gen Tech, and Future Mobility.
Recognized for its adaptability to industry changes.
It has established itself as a premier platform for showcasing technological innovations.
About COMPUTEX

Established in 1981, COMPUTEX TAIPEI (also called COMPUTEX) is the leading global ICT and IoT show with a complete supply chain and ecosystems.
Co-organized by the Taiwan External Trade Development Council (TAITRA) and Taipei Computer Association (TCA), COMPUTEX, based upon Taiwan’s complete ICT clusters, covers the whole spectrum of ICT industry, from established brands to startups and from ICT supply chain to IoT ecosystems.
With strong R&D and manufacturing capabilities and IPR protection, Taiwan is a strategic destination for foreign companies and investors looking for partners in global technology ecosystems

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IMS2026
2026-06-07 - 2026-06-12 | Boston, MA, Boston, MA, United States
Welcome to IMS2026

The IEEE International MTT Symposia (IMS) (www.ims-ieee.org) is the world’s premier RF/microwave technical conference and industry exhibition. Attendees will appreciate that IMS2026 has been refreshed with the technical content reorganized, and new branding, new website, and new mobile app launched.
IMS2026 kicks off with the IEEE MTT-S RF Integrated Circuits (RFIC) Symposium, then introduces two new symposia formed out of traditional IMS technical content, the IEEE MTT-S RF Technology & Techniques (RFTT) Symposium and the IEEE MTT-S RF Systems & Applications (RFSA) Symposium, before concluding the week with the ARFTG Microwave Measurement Conference.

A Week of Opportunities
In historic Boston, IMS2026 kicks off with the IEEE MTT-S RF Integrated Circuits (RFIC) Symposium, then introduces two new symposia formed out of traditional IMS technical content, the IEEE MTT-S RF Systems & Applications (RFSA) Symposium and IEEE MTT-S RF Technology & Techniques (RFTT) Symposium, before concluding the week with the ARFTG Microwave Measurement Conference.

IMS2026 isn’t just about innovation — it’s about connection. It’s the best place to network with peers, learn from experts, uncover new opportunities, and tackle the challenges defining the future of our field. This is where the community comes together to learn about groundbreaking theories and practices, and explore cutting-edge products and services.
IMS by the Numbers

8,484 registered attendees representing 55 countries
500+ exhibiting companies, including 98 first timer exhibitors
14 Start-Up Pavilion participants
200+ education sessions

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2026 IEEE/JSAP Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
2026-06-14 - 2026-06-18 | Honolulu, Hawaii, Honolulu, HI, United States
New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) – Advanced gate stack and interconnect in VLSI processes and devices – Advanced lithography and fine patternig technologies for high density VLSI – New functional devices beyond CMOS with a path for VLSI implantation – Packing of VLSI devices including 3D – system integration – Processes and devices modeling of VLSI devices – Reliability related to the above devices.
Honolulu, Hawaii, USA | Event Format : Hybrid (In-person and Virtual)
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Automobil-Elektronik Kongress 2026
2026-06-16 - 2026-06-17 | Forum am Schlosspark, Stuttgarter Str. 33, Ludwigsburg, 71638, Germany
We are excited to announce the 30th Automobil-Elektronik Kongress, set to take place on June 16 and 17, 2026 at the Forum am Schlosspark in Ludwigsburg, Germany. This prestigious technical conference will bring together industry experts, researchers, and innovators to discuss the latest advancements in automotive electronics. Join us to stay at the forefront of innovation in the automotive electronics industry and network with leading professionals in the field.
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ISC 2026
2026-06-22 - 2026-06-26 | Hamburg, Germany, Hamburg, Germany
CONFERENCE & EXHIBITION

HPC, AI, Quantum: Powering Innovation and Sustainability

ISC 2026 connects scientists, engineers, and technology leaders to explore the future of high performance computing. We will examine today’s breakthroughs in artificial intelligence, high performance computing and quantum technologies, as well as what lies ahead.
Additionally, we are committed to sustainability by promoting energy-efficient and cost-effective computing, while empowering the next-generation workforce to continue the community’s legacy of innovation.
ISC 2026 will bring together a mix of people from different backgrounds and areas of expertise to drive HPC. Whether you are just entering the field, in a mid-level position, a part of senior management, or a student, we welcome you to join our efforts to connect people and technologies.

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AI Infra Summit 2026
2026-09-15 - 2026-09-17 | Santa Clara Convention Center, Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, CA, United States
What is the AI Infra Summit?

The AI Infra Summit is the premier full-stack AI Infrastructure conference, arranged in a modular way that equally enables both enterprises and technology/solution providers to benefit from domain-specific content, all while doing business on the exhibition floor. Our 4 track event is divided into Hardware & Systems, Edge AI Infrastructure, Enterprise AI, & Datacenter Infrastructure.
The AI Infra Summit takes place Tuesday – Thursday, 15-17 September 2026.
Registration opens at 9am, Keynotes begin 10am, Exhibition Hall opens 12:30pm.
The event takes place at the Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, CA 95054, United States.

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