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BEGIN:VEVENT
DTSTART;VALUE=DATE:20260610
DTEND;VALUE=DATE:20260612
DTSTAMP:20260415T012620
CREATED:20260326T224703Z
LAST-MODIFIED:20260326T224703Z
UID:367952-1781049600-1781222399@semiwiki.com
SUMMARY:2026 European Executive Forum
DESCRIPTION:June 10 8:00 AM – June 11 5:00 PM CEST\n2026 European Executive Forum\n\nMunich\, Germany\n\nREGISTER HERE
URL:https://semiwiki.com/event/2026-european-executive-forum/
LOCATION:Munich\, Germany
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260614
DTEND;VALUE=DATE:20260619
DTSTAMP:20260415T012620
CREATED:20250828T061019Z
LAST-MODIFIED:20250828T061019Z
UID:361103-1781395200-1781827199@semiwiki.com
SUMMARY:2026 IEEE/JSAP Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
DESCRIPTION:New concepts and breakthroughs in VLSI processes and devices including Memory\, Logic\, I/O\, and I/F (RF/Analog/MS\, Imager\, MEMS\, etc.) – Advanced gate stack and interconnect in VLSI processes and devices – Advanced lithography and fine patternig technologies for high density VLSI – New functional devices beyond CMOS with a path for VLSI implantation – Packing of VLSI devices including 3D – system integration – Processes and devices modeling of VLSI devices – Reliability related to the above devices. \nHonolulu\, Hawaii\, USA  |  Event Format : Hybrid (In-person and Virtual) \nREGISTER HERE
URL:https://semiwiki.com/event/2026-ieee-jsap-symposium-on-vlsi-technology-and-circuits-vlsi-technology-and-circuits/
LOCATION:Honolulu\, Hawaii\, Honolulu\, HI\, United States
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2025/08/Screenshot-2025-08-27-230953.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260616
DTEND;VALUE=DATE:20260618
DTSTAMP:20260415T012620
CREATED:20250828T061412Z
LAST-MODIFIED:20250828T061412Z
UID:361106-1781568000-1781740799@semiwiki.com
SUMMARY:Automobil-Elektronik Kongress 2026
DESCRIPTION:We are excited to announce the 30th Automobil-Elektronik Kongress\, set to take place on June 16 and 17\, 2026 at the Forum am Schlosspark in Ludwigsburg\, Germany. This prestigious technical conference will bring together industry experts\, researchers\, and innovators to discuss the latest advancements in automotive electronics. Join us to stay at the forefront of innovation in the automotive electronics industry and network with leading professionals in the field. \nREGISTER HERE
URL:https://semiwiki.com/event/automobil-elektronik-kongress-2026/
LOCATION:Forum am Schlosspark\, Stuttgarter Str. 33\, Ludwigsburg\, 71638\, Germany
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2025/08/Screenshot-2025-08-27-231304.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260617
DTEND;VALUE=DATE:20260620
DTSTAMP:20260415T012620
CREATED:20260107T105806Z
LAST-MODIFIED:20260107T105806Z
UID:365400-1781654400-1781913599@semiwiki.com
SUMMARY:3D & Systems Summit 2026
DESCRIPTION:Themed Heterogeneous Integration: Bolstering Europe’s Resilience the 3D & Systems Summit 2025 will primarily focus on exploring strategies for enhancing Europe’s semiconductor industry addressing topics as geopolitical dynamics\, market trends\, as well as the latest advancements in chiplet applications and hybrid bonding techniques. The Summit will feature an exclusive exhibition area\, showcasing industry leaders alongside innovative emerging companies. This Summit is a platform for gathering and exchange of knowledge and fostering of collaborations within the semiconductor sector. \nAttendees will have several opportunities for B2B matching\, including networking receptions\, coffee breaks\, lunches\, and a unique Networking Dinner Cruise along the beautiful Elbe River. \nREGISTER HERE
URL:https://semiwiki.com/event/3d-systems-summit-2026/
LOCATION:Hilton Dresden Hotel\, Hilton Dresden Hotel\, An der Frauenkirche 5 D\, Dresden\, 01067\, Germany
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2026/01/Screenshot-2026-01-07-025739.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260622
DTEND;VALUE=DATE:20260627
DTSTAMP:20260415T012620
CREATED:20251211T213919Z
LAST-MODIFIED:20251211T213919Z
UID:364634-1782086400-1782518399@semiwiki.com
SUMMARY:ISC 2026
DESCRIPTION:CONFERENCE & EXHIBITION\n\n\n\n\n\n\n\n\nHPC\, AI\, Quantum: Powering Innovation and Sustainability \n\n\n\n\nISC 2026 connects scientists\, engineers\, and technology leaders to explore the future of high performance computing. We will examine today’s breakthroughs in artificial intelligence\, high performance computing and quantum technologies\, as well as what lies ahead. \nAdditionally\, we are committed to sustainability by promoting energy-efficient and cost-effective computing\, while empowering the next-generation workforce to continue the community’s legacy of innovation. \nISC 2026 will bring together a mix of people from different backgrounds and areas of expertise to drive HPC. Whether you are just entering the field\, in a mid-level position\, a part of senior management\, or a student\, we welcome you to join our efforts to connect people and technologies. \n\n\n\n\nREGISTER HERE
URL:https://semiwiki.com/event/isc-2026/
LOCATION:Hamburg\, Germany\, Hamburg\, Germany
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2025/12/Screenshot-2025-12-11-133841.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260623
DTEND;VALUE=DATE:20260624
DTSTAMP:20260415T012620
CREATED:20260114T021718Z
LAST-MODIFIED:20260129T235644Z
UID:365702-1782172800-1782259199@semiwiki.com
SUMMARY:Verification Futures Conference 2026 UK
DESCRIPTION:Verification Futures UK 2026\, co-located with Semiconductors Futures 2026 organised by Tessolve and co-organised this year with Alpinum. The conference continues its strong tradition of delivering a unique blend of conference presentations\, exhibitions\, training\, and industry networking sessions focused on the challenges faced in hardware and software verification. The event remains an important forum for end-users to define their verification challenges and collaborate with engineers\, researchers\, and vendors to shape practical solutions. In 2026\, Verification Futures continues to strengthen its core emphasis on verification methodologies\, DV tools\, and engineering workflows\, including areas such as formal methods for complex SoCs\, CPU & RISC-V verification\, open-source and licence-free verification tools\, AI in design verification (AI in DV)\, verification planning and coverage\, and HW/SW co-verification. \nSemiconductors Futures 2026 brings together the semiconductor community\, covering AI/ML in IP & SoC design\, AI’s impact on EDA and workflows\, FPGA & mixed-signal\, with a focus on the automotive\, data centre\, and AI products. New tracks consider emerging technologies such as quantum computing\, photonics\, and chiplets\, as well as startups and investments. We expect 50+ engineering students to attend a separate session. \nCALL FOR PAPERS \nREGISTER HERE
URL:https://semiwiki.com/event/verification-futures-conference-2026-uk/
LOCATION:Hybrid: In-Person and Virtual Conference\, Reading\, United Kingdom
ATTACH;FMTTYPE=image/jpeg:https://semiwiki.com/wp-content/uploads/2026/01/unnamed-2.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260623
DTEND;VALUE=DATE:20260626
DTSTAMP:20260415T012620
CREATED:20260414T063431Z
LAST-MODIFIED:20260414T063431Z
UID:368412-1782172800-1782431999@semiwiki.com
SUMMARY:LID World Summit 2026
DESCRIPTION:CEA-Leti’s flagship event\n\n\n\n\nDiscover sustainable semiconductor breakthroughs to guide your roadmap from lab-to-market and to tomorrow’s AI factory at LID World Summit 2026. \nJoin industry leaders to discover groundbreaking innovation that will help meet technological goals for the healthcare\, automotive\, industrial\, defense\, and consumer-electronics sectors. Leave with confidence in the possible. \n\n\nREGISTER HERE
URL:https://semiwiki.com/event/lid-world-summit-2026/
LOCATION:Grenoble\, France
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2026/04/Screenshot-2026-04-13-233332.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260627
DTEND;VALUE=DATE:20260628
DTSTAMP:20260415T012620
CREATED:20260414T062122Z
LAST-MODIFIED:20260414T062122Z
UID:368392-1782518400-1782604799@semiwiki.com
SUMMARY:Scaling DRAM Technology to Meet Future Demands: System Challenges and Opportunities
DESCRIPTION:Tutorial Abstract\nSince the invention of the 1T1C bit cell more than 50 years ago\, DRAMs have become the main memory of choice for processors in computing systems and consumer electronics devices. As new computing paradigms have been created\, including AI\, 3D graphics\, HPC\, cloud computing\, and smart phones\, specialized processors and DRAM memories have been developed that are optimized for these use cases. The same 1T1C DRAM bit cell is used in each of these applications\, but the internal architecture and interfaces of the DRAMs supporting these markets are optimized in different ways\, and the DRAMs are packaged differently (sometimes with additional buffer chips) to meet the needs of the system. \nAcross all markets\, there is a relentless demand for higher performance and better power efficiency\, as insufficient DRAM bandwidth can bottleneck application performance and interfaces to DRAMs can consume half of the SOC power. DRAMs are also being stressed by growing reliability concerns as they incorporate on-die ECC and mitigation for disturbance effects such as RowHammer and RowPress. As AI continues to grow across markets (HPC\, server\, client\, mobile\, etc.)\, the design of efficient\, performant and reliable memory systems is becoming increasingly critical. AI models are continuing to grow\, pushing the capacity and bandwidth requirements of DRAMs. Simply scaling with historical techniques will no longer achieve the required characteristics due to physical challenges\, limits of process scaling\, and system architecture constraints including thermals and power delivery. \nThis tutorial will describe DRAM architecture in detail\, highlighting the similarities and differences between different DRAM technologies and the unique tradeoffs and design choices made to meet system needs. We will also cover the key components that memory transactions travel thorough to get to DRAMs and back\, including memory controllers\, PHYs\, and where applicable\, modules and buffer chips. We will describe the architecture of these critical components and discuss how DRAM architecture choices impact their performance and power efficiency. Standard scaling techniques for DRAMs will be highlighted along with challenges that the industry is currently facing. Input from industry experts will show the pros and cons of DRAM architecture choices\, demonstrating the system impact and requirements for mainstream adoption. Future DRAM architectures will also be discussed. \nTopics that will be covered\nThe tutorial will focus on DRAM architecture\, specifically looking at design tradeoffs and subsequent impact to the overall system performance\, power\, cost and reliability. The tutorial will cover the following topics: \n\nBackground and History of DRAM markets. How they were historically defined\, what changed\, and the drivers of new technologies.\nDRAM array architecture\, internal data paths\, shared structures\, and interfaces.\nThe future of DRAM\, including 3D DRAM cells.\nMemory modules\, including DIMMs\, CAMMs\, MRDIMMs\, and CXL modules and their buffer chips.\nCapacity\, power\, reliability\, cost tradeoffs that motivate different DRAM architectures for different markets including computing\, mobile\, graphics\, and AI. This will include underlying core architecture\, packaging and system integration.\nPower and energy differences between DRAM technologies.\nNovel packaging techniques including stacking and 2.5D assembly.\nReliability\, Availability\, and Serviceability (RAS) techniques\, including on-die error correction\, system-level ECC\, redundancy and repair\, and RowHammer and RowPress mitigation.\nProcessing in memory that has been implemented in DRAM silicon.\nMemory controller architecture and design challenges with current and future DRAMs.\nPHY architectures and challenges with achieving higher data rates and power efficiencies.\nSystem performance considerations\, including latency under load and the impact of core timings and core architecture on performance.\nMemory system architecture considerations to achieve maximum performance\, highlighting the impact of DRAM core timing and architecture tradeoffs on the host controller design.\nIndustry adoption challenges facing new DRAM technologies and features.\nChallenges for the future.\n\nOrganizers and Affiliations\nSteven Woo is a Fellow and Distinguished Inventor at Rambus Inc.\, where he leads research in Rambus Labs on advanced memory systems for accelerators and computing infrastructure\, and manages a team of senior architects. Since joining Rambus\, Steve has worked in various roles leading architecture\, technology\, and performance analysis efforts\, and in marketing and product planning roles leading strategy and customer programs.  He has more than 30 years of experience working on advanced memory systems and holds more than 100 US and international patents. Steve received his PhD and MS degrees in Electrical Engineering from Stanford University\, and Master of Engineering and BS Engineering degrees from Harvey Mudd College. \nWendy Elsasser is a Technical Director of Research Science at Rambus Inc. She works in the Rambus Labs R&D division researching future system architecture and developing innovative solutions to address the challenges of the memory sub-system. She has over 25 years of experience in industry\, starting with semi-custom micro-controller design\, test\, and implementation. Over the last 20 years\, her focus has been on memory sub-systems\, primarily external DRAM. Her experience includes DRAM controller architecture\, design\, and validation as well as active contributions to consortiums and standards bodies. Specifically\, she was a leader in the Gen-Z consortium and JEDEC\, helping to define future memory interfaces and DRAM standards. Her work has resulted in 15 patents. \nRobert Palmer is a Senior Technical Director of Research Science at Rambus Inc.\, leading research in future memory module and memory buffer chip architectures. He has over 25 years of industry experience developing silicon IP and communication ICs\, spanning the design of high-speed wireline transceiver circuits\, serial link and memory controller PHY microarchitectures\, and DDR and CXL memory buffer chip architectures and microarchitectures. In addition to his tenure at Rambus\, Robert has held positions at Velio Communications and Nvidia Research. He holds over 60 US and international patents. \nTaeksang Song is a Corporate Vice President at Samsung Electronics where he is leading a team dedicated to pioneering cutting-edge technologies including CAMM\, MRDIMM\, CXL memory expanders\, fabric attached memory solutions and processing near memory to meet the evolving demands of next-generation data-centric AI architectures. He has 20 years of professional experience in memory and sub-system architecture\, interconnect protocols\, system-on-chip design and collaborating with CSPs to enable heterogeneous computing infrastructure. Prior to joining Samsung Electronics\, he worked at Rambus Inc.\, Micron Technology and SK hynix in lead architect roles for the emerging memory controllers and systems. Taeksang received his PhD from KAIST\, South Korea\, in 2006. He has authored and co-authored over 20 technical papers and holds over 50 U.S. patents. \nREGISTER HERE
URL:https://semiwiki.com/event/scaling-dram-technology-to-meet-future-demands-system-challenges-and-opportunities/
LOCATION:Raleigh\, North Carolina\, Raleigh\, NC\, United States
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2026/04/Screenshot-2026-04-13-232033.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260627
DTEND;VALUE=DATE:20260702
DTSTAMP:20260415T012620
CREATED:20260414T062249Z
LAST-MODIFIED:20260414T062249Z
UID:368397-1782518400-1782950399@semiwiki.com
SUMMARY:ISCA 2026
DESCRIPTION:The International Symposium on Computer Architecture (ISCA) is the premier forum for new ideas and experimental results in computer architecture. The conference specifically seeks particularly forward-looking and novel submissions. In 2026\, the 53rd edition of ISCA will be held in Raleigh at the Raleigh Convention Center from June 27 to July 1\, 2026. \nREGISTER HERE
URL:https://semiwiki.com/event/isca-2026/
LOCATION:Raleigh Convention Center\, Raleigh Convention Center\, 500 Fayetteville St\, Raleigh\, NC\, 27601\, United States
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2026/04/Screenshot-2026-04-13-232202.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260628
DTEND;VALUE=DATE:20260702
DTSTAMP:20260415T012620
CREATED:20260107T110056Z
LAST-MODIFIED:20260107T110056Z
UID:365403-1782604800-1782950399@semiwiki.com
SUMMARY:ALD/ALE 2026
DESCRIPTION:Overview\n\n\n\n\nThe AVS 26th International Conference on Atomic Layer Deposition (ALD 2026) featuring the 13th International Atomic Layer Etching Workshop (ALE 2026) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and atomic layer etching.  Since 2001\, the ALD conference has been held alternately in the United States\, Europe and Asia\, allowing fruitful exchange of ideas\, know-how and practices between scientists. The conference will take place Sunday\, June 28-Wednesday\, July 1\, 2026\, at the JW Marriott Water Street\, Tampa\, Florida. \nAs in past conferences\, the meeting will be preceded (Sunday\, June 28) by one day of tutorials and perspectives and a welcome reception. Sessions will take place (Monday-Wednesday\, June 29-July 1) along with an industry tradeshow. All presentations will be audio-recorded and provided to attendees following the conference (posters will be included as PDFs). Anticipated attendance is 700+. View List of Invited Speakers \n\n\nREGISTER HERE
URL:https://semiwiki.com/event/ald-ale-2026/
LOCATION:JW Marriott Water Street\, JW Marriott Water Street\, 510 Water St\, Tampa\, FL\, 33602\, United States
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2026/01/Screenshot-2026-01-07-025943.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260629
DTEND;VALUE=DATE:20260702
DTSTAMP:20260415T012620
CREATED:20260211T220710Z
LAST-MODIFIED:20260211T220710Z
UID:366633-1782691200-1782950399@semiwiki.com
SUMMARY:Realize LIVE Europe 2026
DESCRIPTION:Join us in 2026\nWe are ready to deliver more \n1\,800+ attendees. Join our community of users\, industry experts and trusted partners. Realize LIVE offers something for everyone! \n350+ sessions. Explore breakout sessions\, technical tracks\, trainings and more. More than 60% of sessions were led by customers\, sharing real-world insights. \n90% overall satisfaction rate. Realize LIVE is your digital transformation destination! Join our community and walk away a better user. \n\n\n\n\nAccelerate your digital transformation journey\n\n\n\n\n\nLearned from experts and industry leaders\, built skills and discovered the latest trends and technology with more than 350+ sessions at Realize LIVE Europe. \n\n\n\n\n\n\nBecome a better user\nLeave empowered — 88% of attendees left Realize LIVE Europe 2025 with new skills and enhanced tool proficiency. \n\n\nGet inspired by thought leaders\nIn 2025 over 60% of sessions were led by customers\, sharing real-world insights and innovations. You can expect even more in 2026. \n\n\nStay ahead with product roadmaps\nAttendees will stay up-to-date with exclusive product presentations showcasing the latest advancements in Siemens technology\, and hear about functionality updates\, so you can plan for what comes next. \n\n\nGain exclusive hands-on training and certification\nAttendees receive complimentary hands-on training\, 60 days access to Siemens Xcelerator Academy and 20 lab hours. Plus\, the opportunity to earn your Siemens Xcelerator Certification (€1000 value). \n\n\nConnect and celebrate with product experts\nJoined dedicated portfolio meet-ups\, industry receptions and our Community Corner to connect with peers who are on their digital transformation journey. Don’t forget the evening events — a great chance to relax and network! \n\n\nDive into the Siemens ecosystem\nRealize LIVE Europe is your destination for all things digital transformation. Meet experts\, engage with partners and experience live demos in the Solutions Center. \n\n\n\nREGISTER HERE
URL:https://semiwiki.com/event/realize-live-europe-2026/
LOCATION:RAI Amsterdam Convention Centre\, Europaplein 24\, Amsterdam\, 1078 GZ\, Netherlands
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2026/02/Screenshot-2026-02-11-140637.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260629
DTEND;VALUE=DATE:20260703
DTSTAMP:20260415T012620
CREATED:20260107T110301Z
LAST-MODIFIED:20260107T110301Z
UID:365409-1782691200-1783036799@semiwiki.com
SUMMARY:SMACD 2026
DESCRIPTION:Welcome to SMACD 2026\nInternational Conference on Synthesis\, Modeling\, Analysis and Simulation Methods\, and Applications to Circuit Design \nREGISTER HERE
URL:https://semiwiki.com/event/smacd-2026/
LOCATION:Dresden\, Germany\, Dresden\, Germany
ATTACH;FMTTYPE=image/jpeg:https://semiwiki.com/wp-content/uploads/2026/01/images-1.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260630
DTEND;VALUE=DATE:20260701
DTSTAMP:20260415T012620
CREATED:20260414T060533Z
LAST-MODIFIED:20260414T060533Z
UID:368379-1782777600-1782863999@semiwiki.com
SUMMARY:CadenceCONNECT: Tech Days Europe 2026 - Leuven
DESCRIPTION:Join us at CadenceCONNECT: Tech Days Europe 2026\, our annual\, free\, multi-track event dedicated to the engineers\, innovators\, and visionaries shaping the future of electronic design. Our aim is to bring together like minded thinkers to explore how AI-driven Cadence technologies are transforming design workflows\, boosting productivity\, and enabling breakthroughs across every domain. \nREGISTER HERE
URL:https://semiwiki.com/event/cadenceconnect-tech-days-europe-2026-leuven/
LOCATION:Leuven\, Belgium\, Leuven\, Belgium
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2026/04/Screenshot-2026-04-13-225642.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260702
DTEND;VALUE=DATE:20260703
DTSTAMP:20260415T012620
CREATED:20260414T060635Z
LAST-MODIFIED:20260414T060635Z
UID:368381-1782950400-1783036799@semiwiki.com
SUMMARY:CadenceCONNECT: Tech Days Europe 2026 - Barcelona
DESCRIPTION:Join us at CadenceCONNECT: Tech Days Europe 2026\, our annual\, free\, multi-track event dedicated to the engineers\, innovators\, and visionaries shaping the future of electronic design. Our aim is to bring together like minded thinkers to explore how AI-driven Cadence technologies are transforming design workflows\, boosting productivity\, and enabling breakthroughs across every domain. \nREGISTER HERE
URL:https://semiwiki.com/event/cadenceconnect-tech-days-europe-2026-barcelona/
LOCATION:Barcelona\, Spain\, Barcelona\, Spain
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2026/04/Screenshot-2026-04-13-225642.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260726
DTEND;VALUE=DATE:20260730
DTSTAMP:20260415T012620
CREATED:20260107T110547Z
LAST-MODIFIED:20260107T110547Z
UID:365412-1785024000-1785369599@semiwiki.com
SUMMARY:DAC 2026
DESCRIPTION:The Long Beach Convention Center will serve as a dynamic venue for DAC 2026: The Chips to Systems Conference. Set along the scenic Southern California coastline\, the center offers modern meeting spaces and a vibrant setting that reflects the innovative spirit of DAC. Its central location in downtown Long Beach provides easy access to hotels\, dining\, and entertainment\, making it an ideal hub for bringing together industry leaders\, researchers\, and practitioners to explore the future of design automation from chips to systems. \n\nWhat is DAC?\n\nLeading worldwide event for design engineering professionals since 1963 \n\n\n\n\n\n\nDAC: The Chips to Systems Conference DAC is where the future of electronic design takes shape. Each year\, system architects\, chip designers\, engineers\, researchers\, and executives from 11\,000+ organizations worldwide come together to learn\, connect\, and innovate. With over 60 expert-selected technical sessions and 150 exhibitors showcasing the latest in AI automated tools\, EDA\, and IP\, DAC is the place to discover breakthrough ideas\, build lasting connections\, and stay at the forefront of the chip design industry. Don’t miss it. \n\n\n\nREGISTER HERE
URL:https://semiwiki.com/event/dac-2026/
LOCATION:Long Beach Convention & Entertainment Center\, 300 E Ocean Blvd\, Long Beach\, CA\, 90802\, United States
ATTACH;FMTTYPE=image/webp:https://semiwiki.com/wp-content/uploads/2026/01/dac26-web-hero_09.29.25.webp
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260804
DTEND;VALUE=DATE:20260806
DTSTAMP:20260415T012620
CREATED:20260211T220912Z
LAST-MODIFIED:20260211T220912Z
UID:366636-1785801600-1785974399@semiwiki.com
SUMMARY:Realize LIVE Asia-Pacific 2026
DESCRIPTION:Where your digital transformation gets real — fast\nWe are excited to be visiting a new city with the Realize LIVE digital transformation conference to showcase artifial intelligence\, digitalization\, sustainability and optimization across the product lifecycle. Learn\, network and connect with the Siemens software community\, and walk away with new tools and insights for your digital journey. \nGet a sneak peek of what you can expect! \n\n\n\n\nAccelerate your digital transformation journey\n\n\n\n\n\n\n\nBecome a better user\nLeave empowered — 85% of Realize LIVE event attendees leave with new skills and enhanced tool proficiency. \n\n\nBecome inspired by thought leaders\nRealize LIVE participants become inspired after attending sessions led by customers and Siemens experts\, who share real-world insights and innovations\, leave event participants inspired. \n\n\nStay ahead with product roadmaps\nStay up-to-date with exclusive product presentations showcasing the latest advancements in Siemens technology\, and preview upcoming updates to plan for what’s next. \n\n\nGain exclusive access to training and certification\nGet 60 days of access to Siemens Xcelerator Academy\, as well as a voucher to Siemens Xcelerator Certification (valid for six months). \n\n\nConnect and celebrate with product experts\nJoin the Realize LIVE reception and dedicated meet-ups to connect with peers who are on their digital transformation journey. \n\n\nDive into the Siemens ecosystem\nRealize LIVE is your destination for all things related to digital transformation. Meet experts; engage with partners; and experience live demos in the solutions center. \n\n\n\nREGISTER HERE
URL:https://semiwiki.com/event/realize-live-asia-pacific-2026/
LOCATION:Bengaluru\, India\, Bengaluru\, India
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2026/02/Screenshot-2026-02-11-140843.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260915
DTEND;VALUE=DATE:20260918
DTSTAMP:20260415T012620
CREATED:20251009T050205Z
LAST-MODIFIED:20251015T145440Z
UID:362509-1789430400-1789689599@semiwiki.com
SUMMARY:AI Infra Summit 2026
DESCRIPTION:What is the AI Infra Summit?\n\nThe AI Infra Summit is the premier full-stack AI Infrastructure conference\, arranged in a modular way that equally enables both enterprises and technology/solution providers to benefit from domain-specific content\, all while doing business on the exhibition floor. Our 4 track event is divided into Hardware & Systems\, Edge AI Infrastructure\, Enterprise AI\, & Datacenter Infrastructure. \nThe AI Infra Summit takes place Tuesday – Thursday\, 15-17 September 2026. \nRegistration opens at 9am\, Keynotes begin 10am\, Exhibition Hall opens 12:30pm. \nThe event takes place at the Santa Clara Convention Center\, 5001 Great America Pkwy\, Santa Clara\, CA 95054\, United States. \n\nREGISTER HERE
URL:https://semiwiki.com/event/ai-infra-summit-2026/
LOCATION:Santa Clara Convention Center\, Santa Clara Convention Center\, 5001 Great America Pkwy\, Santa Clara\, CA\, United States
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2025/10/Screenshot-2025-10-08-220133.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261104
DTEND;VALUE=DATE:20261105
DTSTAMP:20260415T012620
CREATED:20260211T221220Z
LAST-MODIFIED:20260211T221220Z
UID:366639-1793750400-1793836799@semiwiki.com
SUMMARY:User2User Mid-Atlantic 2026
DESCRIPTION:About User2User Mid-Atlantic\n\nUser2User Mid-Atlantic is focused around these areas: \n\nPrinted circuit board design (PCB) and design for manufacturing\nPCB simulation\nApplication specific integrated circuit and field programmable gate array: advanced functional verification\nCalibre design\n\nWhy attend User2User Mid-Atlantic 2026?\nLearn\nPeer-delivered technical sessions will cover a wide range of topics\, so you can explore new concepts or dive deep into your core area of expertise with fellow like-minded professionals. \nConnect\nNetwork with like-minded peers and electronic design automation (EDA) industry leaders exploring macro trends\, as well as super users sharing business challenges and solutions to their roadblocks. \nGrow\nEDA visionaries will share insights into global cross-industry challenges from companies who are optimizing their business using Siemens EDA tools. \n\nREGISTER HERE
URL:https://semiwiki.com/event/user2user-mid-atlantic-2026/
LOCATION:Laurel\, MD\, Laurel\, MD\, United States
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2026/02/Screenshot-2026-02-11-141153.png
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20261108
DTEND;VALUE=DATE:20261113
DTSTAMP:20260415T012620
CREATED:20260219T213519Z
LAST-MODIFIED:20260219T213519Z
UID:366845-1794096000-1794527999@semiwiki.com
SUMMARY:ICCAD 2026
DESCRIPTION:Call for Papers\n \nJointly sponsored by IEEE and ACM\, IEEE/ACM ICCAD is the premier forum to explore new challenges\, present leading-edge innovative solutions\, and identify emerging technologies in the electronic design automation research areas. IEEE/ACM ICCAD covers the full range of CAD topics – from device and circuit level up through system level\, as well as post-CMOS design. IEEE/ACM ICCAD has a long-standing tradition of producing cutting-edge\, innovative technical program for attendees. \n\n\n\n\n\n\n\n\n\nREGISTER HERE
URL:https://semiwiki.com/event/iccad-2026/
LOCATION:San Jose\, CA
ATTACH;FMTTYPE=image/webp:https://semiwiki.com/wp-content/uploads/2026/02/iccad26-logo-hr_color-1768520579.webp
END:VEVENT
END:VCALENDAR