NXP Connects
Oct 20-21 Americas, EMEA | Oct 21-22 APAC REGISTER NOW Join a global audience of developers, designers, and decision makers advancing the world of embedded systems applications at NXP's first …
Oct 20-21 Americas, EMEA | Oct 21-22 APAC REGISTER NOW Join a global audience of developers, designers, and decision makers advancing the world of embedded systems applications at NXP's first …
For more than a decade, The Linley Group has delivered the industry’s premier processor conference. This year, the Linley Fall Processor Conference will feature virtual presentations that run half days …
October 21, 2020 11:30 AM IST Venue: Online Design optimization has become an imperative ritual among numerous industries to achieve optimum product performance and reduce costs, thereby achieving smarter designs …
Continue reading "Topology Optimization using Ansys Mechanical"
A Digital Experience - October 21 Overview CadenceCONNECT will introduce you to optimized design methodologies for electronics system applications. The event brings together Cadence technology users, developers, and industry experts …
Register For This Web Seminar Online - Oct 21, 2020 11:00 AM - 12:00 PM America/Sao_Paulo Convert to Local Time Register Overview Ensure that quality and efficiency are integrated into …
Continue reading "Smart Manufacturing for Electronics Webinar – Brazil – Session #2"
A Digital Event - October 21 - 22 Ready to share and discuss the latest design and verification best practices with your peers from around the world? It’s time for …
21 October 2020 @ 11:00 am-12:00 pm This free to attend automotive cybersecurity webinar hosted by the Institute of Engineering and Technology (IET) features a presentation by Aileen Ryan, …
Register For This Web Seminar Online - Oct 22, 2020 11:00 AM - 12:00 PM US/Eastern Convert to Local Time Register Overview Everyone’s design goal is to get it “right-the-first-time”, …
Continue reading "Webinar Rigid-Flex Design: Can it be done without respins"
Webinar Overview With recent advances in packaging technology it is possible to connect multiple dies on a single package. OpenFive’s D2D Controller provides end to end connection from one die …
Continue reading "WEBINAR: Protocol Agnostic Die-to-Die Connectivity for Chiplets and HPC"
Abstract: Hardware assisted verification became much more affordable due to the availability of high capacity FPGAs such as Xilinx Virtex UltraScale US440 and their adoption for emulation verification environments. One …
Continue reading "How to Build PCIe Speed Adapters for In-Circuit SoC Emulation"
Date/Time: October 23, 2020 10:00am - 2:00pm PDT Overview Cadence Is Joining the Virtual Clastech 2020! Clastech is a technical symposium held yearly highlighting recent developments in RF and microwave technologies as a …
Held online October 23, 2020 (Friday) CadenceLIVE 2020 is Going Digital! CadenceLIVE (formerly CDNLive) helps technology users, developers, and industry experts gather and share ideas and best practices to inspire …