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DTSTART;VALUE=DATE:20260927
DTEND;VALUE=DATE:20261003
DTSTAMP:20260824T081206Z
CREATED:20260824T081206Z
LAST-MODIFIED:20260824T081206Z
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SUMMARY:ICSCRM 2026
DESCRIPTION:On behalf of the organizing committee\, it is my great honor and pleasure to welcome you to Yokohama\, Japan\, for the 23rd International Conference on Silicon Carbide and Related Materials (ICSCRM 2026)\, September 27－October 2\, 2026. \nThe ICSCRM conference series is the premier international forum focusing on all aspects of silicon carbide and related materials. With the goal of achieving carbon neutrality through significant energy savings\, the importance of low-loss power devices using silicon carbide and related materials is increasing. Currently\, efforts are being made to enhance the materials\, improve the performance and reliability of the devices\, and increase productivity to expand practical applications. Ongoing work to develop implementation and circuit technologies to fully utilize the device performance also continues. In the basic research field\, new developments such as applications in harsh environments and quantum sensing are underway. \nIn this context\, we have planned ICSCRM 2026 to bring researchers and engineers together to exchange the latest research and development results and share information on state-of-the-art technologies and products in the field of silicon carbide and related materials. We also hope to create opportunities for international exchanges among researchers and engineers in this field. Your attendance in scientific discussions and technical exhibitions will enhance the outcome of ICSCRM 2026 and create further steps for the future. \nOnce again\, we welcome all presenters\, participants\, exhibitors\, and sponsors to ICSCRM 2026 and hope all attendants enjoy the conference. \nSincerely\, \n\nHidekazu Tsuchida (CRIEPI)\nGeneral Chair\, ICSCRM 2026 \nScope\nThe aim of this conference is to discuss recent advances in crystal growth\, characterization\, control of material properties\, device fabrication and packaging technologies\, system applications as well as quantum applications concerning silicon carbide (SiC) and related materials including nitride-\, oxide- and diamond-based materials. \nIn addition\, it will discuss latest research results in device design\, fabrication\, characterization\, packaging\, and system applications to improve device performance and reliability\, and address to contribute the realization of cutting edge devices and systems for green innovation. \nThe conference also serves as an international forum for the exchange of ideas on recent scientific and technical issues among researchers and engineers in industrial\, academic and public sectors. \nThe scope of this conference covers the following topics on silicon carbide and related materials\, including other wide bandgap (WBG) semiconductors such as III-nitrides\, oxides\, and diamond. \nTopics\n\nMaterial and Growth\nBulk and epitaxial growth\, Wafer manufacturing \nDefects and Characterization\nFundamental properties\, Point and extended defects\, Characterization and imaging techniques\, Surface characterization and modification \nDevice Process and Characterization\nMOS interface and insulators\, Device fabrication processes (e.g. Implantation\, Oxidation\, Surface treatments\, Metallization\, Ohmic and Schottky contact formations\, and Dry etching technologies) \nDevice Physics\, Design\, and Characterization\nDevice design and testing\, Novel device concepts and Characterization\, Modelling and Simulation\, Novel measurements techniques \nDevices and Module Reliability\, Packaging\, and Applications\nModular and driver-circuit technologies\, System applications\, Packaging and device reliabilities \nQuantum Applications and Sensors\nTheoretical and experimental studies\, Optical and electrical quantum techniques\, for Magnetic\, Electric field\, and Temperature sensors\, Single-photon sources and detectors \n\nfor SiC and related materials including other wide bandgap semiconductors such as III-nitrides\, oxides\, and diamond. \nREGISTER HERE
URL:https://semiwiki.com/event/icscrm-2026/
LOCATION:PACIFICO Yokohama NORTH\, 1 Chome-1-2 Minatomirai\, Yokohama\, Kanagawa\, 220-0012\, Japan
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20260928
DTEND;VALUE=DATE:20261002
DTSTAMP:20260616T211452Z
CREATED:20260616T211452Z
LAST-MODIFIED:20260616T211452Z
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SUMMARY:IMAPS Symposium 2026
DESCRIPTION:The 59th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society and held in Boston\, Massachusetts. IMAPS Symposium offers one of the most robust programs for microelectronics and advanced packaging technical content. Each year\, we welcome many repeat attendees as well as hundreds of first-time visitors – early career packaging professionals\, those new to the industry\, and students. \nREGISTER HERE
URL:https://semiwiki.com/event/imaps-symposium-2026/
LOCATION:Encore Boston Harbor Hotel\, Encore Boston Harbor Hotel\, 1 Broadway\, Everett\, MA\, 02149\, United States
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20260928
DTEND;VALUE=DATE:20261003
DTSTAMP:20260922T044843Z
CREATED:20260922T044843Z
LAST-MODIFIED:20260922T044843Z
UID:373877-1790553600-1790985599@semiwiki.com
SUMMARY:RADECS (RADiation and its Effects on Components and Systems Conference) 2026
DESCRIPTION:What is RADECS?\n\n\n\n\nRADECS (RADiation and its Effects on Components and Systems Conference) is the annual international scientific and industrial forum on radiation and its effects on electronics and photonic materials\, devices\, circuits\, sensors and systems. It is organized every year in a European venue and attracts hundreds of scientists and engineers from all over the world who exchange on the latest advances and results about: \n· Basic Mechanisms of Radiation Effects \n· Radiation Effects in Devices and Integrated Circuits: \no Total Ionizing Dose (TID) \no Total Non-Ionizing Dose (TNID) \no Synergistic Effects \no Single Event Effects (SEE) \n· Radiation Environments \n· Radiation Test Facilities & Dosimetry \n· Radiation Hardening Techniques (Device\, board and system level) \n· Radiation Hardness Assurance \n· Radiation Effects in Photonics\, Optoelectronics and Sensors \n· Radiation Effects in complex devices and systems \nThe 2026 edition of the RADECS Conference will be held on September 28 – October 2. The technical session and the industrial exhibition will take place at the Prague Congress Center. The Thematic Workshop will take place at the historic Bethlehem Chapel. RADECS2026 is organized by the Institute of Experimental and Applied Physics\, CTU in Prague on behalf of the RADECS Association and is technically co-sponsored by the IEEE-NPSS. \nIn addition to the usual RADECS topics\, the 2026 Thematic Workshop is entitled “Measuring to Protect Future Missions: The Critical Role of Detection and Novel Dosimetry in Harsh Radiation Environments”. It explores the full spectrum of space radiation monitoring — from simulation to in-orbit measurements — and highlights the importance of accurate\, real-time detection and advanced dosimetry to inform radiation protection strategies for future missions beyond LEO. With contributions from current missions\, as well as insight into next-generation detectors and onboard processing challenges\, the sessions will foster discussion on what we measure\, how we measure it\, and why it matters\, for a cohesive approach to interpreting space radiation environment. \nWithout forgetting a wonderful social program including technical visits\, tours and social events which will allow the attendees and companions to enjoy Prague and surroundings. \nOn behalf of our committee\, we invite you to join us for an outstanding RADECS 2026 conference and we look forward to meeting you in Prague! \nThe General Chairs (Benedikt Bergmann & Julien Mekki)\,\non behalf of the RADECS 2026 Organizing Committee. \n\n\nREGISTER HERE
URL:https://semiwiki.com/event/radecs-radiation-and-its-effects-on-components-and-systems-conference-2026/
LOCATION:Prague\, Czech Republic\, Prague\, Czech Republic
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2026/09/Screenshot-2026-09-21-214815.png
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20260929
DTEND;VALUE=DATE:20261002
DTSTAMP:20260804T044238Z
CREATED:20260804T044213Z
LAST-MODIFIED:20260804T044238Z
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SUMMARY:The AI Conference 2026
DESCRIPTION:About\nShaping the future of AI \nThe AI Conference was founded on a clear belief: AI is not a standalone technology—it is becoming the foundation of modern software\, infrastructure\, and business. \nSince launching in 2023\, the conference has focused relentlessly on applied AI: how AI systems are actually built\, deployed\, governed\, and scaled in the real world. \nWhy\nWhat began as a deeply technical gathering of engineers and researchers has evolved alongside the market. As AI moved from experimentation to enterprise adoption\, The AI Conference expanded to bring together builders\, operators\, executives\, investors\, and policymakers—all with a shared goal of turning AI capability into real impact. \nThe program is designed to reflect how AI is used in practice: \n\nFrontiers explores emerging research and capabilities.\nBuilders focuses on implementation\, infrastructure\, and operations.\nApplied AI showcases production deployments and measurable outcomes.\nStrategy addresses governance\, economics\, and organizational change.\nVertical tracks deliver deep\, industry-specific insight across sectors like healthcare\, finance\, advertising\, and retail.\n\nHands-on workshops\, Hack Day\, and the Startup Showdown ensure the conference is as much about execution as it is about ideas—creating a space where teams build\, companies launch\, and lessons are shared openly. \nREGISTER HERE
URL:https://semiwiki.com/event/the-ai-conference-2026/
LOCATION:Pier 48\, Pier 48\, Shed A and B\, 48 Pier 48\, San Francisco\, CA\, 94158\, United States
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2026/08/Screenshot-2026-08-03-214047.png
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20260929
DTEND;VALUE=DATE:20261003
DTSTAMP:20260921T111638Z
CREATED:20260921T111638Z
LAST-MODIFIED:20260921T111638Z
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SUMMARY:PCB West 2026
DESCRIPTION:The Largest Conference and Exhibition for Printed Circuit Board Design\,\nFabrication and Assembly in the Silicon Valley \nRegistration is now live! Click here to secure your spot today! \n\n\n\n\n\n\nFor more than 30 years PCB West has trained designers\, engineers\, fabricators and\, lately\, assemblers on making printed circuit boards for every product or use imaginable. More than 2\,000 designers\, fabricators\, assemblers and engineers register and more than 100 companies exhibit each year at the four-day technical conference and one-day sold-out exhibition. From high-reliability military/aerospace to cutting-edge IoT and wearables\, there’s something for everyone involved in the electronics supply chain. This is one show you cannot afford to miss. \nBrought to you by PCEA: Engineering Tomorrow’s Electronics! \n\n\n\nREGISTER HERE
URL:https://semiwiki.com/event/pcb-west-2026/
LOCATION:Santa Clara Convention Center\, Santa Clara Convention Center\, 5001 Great America Pkwy\, Santa Clara\, CA\, United States
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2026/09/Screenshot-2026-09-21-041525.png
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20261001
DTEND;VALUE=DATE:20261003
DTSTAMP:20260903T072837Z
CREATED:20260903T072837Z
LAST-MODIFIED:20260903T072837Z
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SUMMARY:3DIC 2026
DESCRIPTION:3DIC 2026 will cover all 3D system integration topics including 3D/2.5D process technology\, interposers\, and chiplets\, materials\, equipment\, circuit technology\, design methodology\, and applications. Attendees will interact with researchers from all around the world. \nREGISTER HERE
URL:https://semiwiki.com/event/3dic-2026/
LOCATION:Georgia Institute of Technology\, Georgia Institute of Technology\, Atlanta\, GA\, 30332\, United States
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2026/09/Screenshot-2026-09-03-002746.png
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DTSTART;TZID=America/Los_Angeles:20261001T080000
DTEND;TZID=America/Los_Angeles:20261001T200000
DTSTAMP:20260915T022247Z
CREATED:20260915T022247Z
LAST-MODIFIED:20260915T022247Z
UID:373613-1790841600-1790884800@semiwiki.com
SUMMARY:2026 IEEE Electronic Design Process Symposium (EDPS)
DESCRIPTION:Overview\n\n\n\n33rd IEEE EDPS will be held at SEMI facilities in Milpitas\, CA. \n\n\n\n\n2026 IEEE EDPS will be held on Oct 1 at SEMI facilities in Milpitas\, CA. \nEDPS is a leading forum for advanced chip and systems design process development as well as CAD methodologies and addresses EDA\, foundry and design industries design and manufacturing challenges. This annual gathering of electronic IC/system designers\, developers\, and manufacturing experts will discuss design methodologies\, design flows and CAD tool needs via keynotes and session presentations in following areas: \n\nInnovative Design Techniques including HSIO and AI/ML\n3D IC and Heterogeneous Integration (including Packaging and Photonics)\nAgentic AI and Its Application in EDA and Design\n\nCheck out IEEE EDPS website for additional program details. \nPlease join us at SEMI this fall! The registration includes refreshments\, breakfast\, and lunch\, as well as dinner on Thursday! \n\n\n\nREGISTER HERE
URL:https://semiwiki.com/event/2026-ieee-electronic-design-process-symposium-edps/
LOCATION:SEMI HQ\, SEMI HQ\, 673 S Milpitas Blvd.\, Milpitas\, CA\, 95035\, United States
ATTACH;FMTTYPE=image/jpeg:https://semiwiki.com/wp-content/uploads/2026/09/image.jpg
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DTSTART;TZID=America/Los_Angeles:20261001T140000
DTEND;TZID=America/Los_Angeles:20261001T150000
DTSTAMP:20260917T222819Z
CREATED:20260917T222819Z
LAST-MODIFIED:20260917T222819Z
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SUMMARY:Webinar: Testing Cars That Don't Exist (Yet): Extending the Automotive Software Factory with Virtual ECUs
DESCRIPTION:Software factories have transformed automotive software development through automation\, continuous integration\, and rapid feedback cycles\, yet achieving the same level of automation and continuous validation across the entire vehicle remains a major challenge. However\, by creating complete virtual vehicles\, engineering teams can test and validate complex software earlier and faster. \nThis 30-minute webinar will explore how electronics digital twins (eDTs) — which combine virtual ECUs (vECUs) with their surrounding virtual environment including models\, simulation assets\, and system context — extend the automotive software factory beyond individual components into continuous vehicle-level integration\, testing\, and validation. By automatically creating vECUs\, assembling complete virtual vehicles\, deploying them in cloud-native software-in-the-loop (SIL) environments\, and integrating an automotive test harness\, engineering teams can validate complex software earlier\, faster\, and with significantly less dependency on physical hardware. \nAttendees will see how a complete virtual vehicle can be brought up on demand and used for debugging\, regression testing\, and continuous validation. The session will demonstrate how scalable\, containerized virtual vehicle environments accelerate software-defined vehicle development — from developer desktops to enterprise CI/CD pipelines. \nAn audience Q&A session will follow the technical presentation. \nREGISTER HERE \nSpeakers:\nMarkus Helmling\, Senior and Product Manager – SIL Kit\, Vector Informatik GmbH\n\nMarkus Helmling is a Senior Manager and Product Manager for SIL Kit within the Testing\, Verification & Validation business unit at Vector Informatik GmbH\, which he joined in 2012. In this role\, Markus is responsible for the development of software testing solutions in and around the CANoe product. He previously held positions in both the automotive supplier industry and building technology sectors. Markus holds a degree in electrical engineering and information technology from Pforzheim University of Applied Sciences. \nKevin Brand\, Senior Architect\, Synopsys\n\nKevin Brand is a Senior Architect for Synopsys\, who has worked in the virtual prototyping field for 20 years. With a strong focus on automotive\, he has concentrated on technology deployment and product management in recent years\, directly enabling and deploying virtual prototyping solutions at semiconductor\, Tier 1\, and OEM companies. He holds a master’s degree in electronic engineering from Napier University and previously worked in the aerospace and defense domain. \nModerator:\nAmanda Hosey\, Editor\, SAE Media Group\n\nREGISTER HERE
URL:https://semiwiki.com/event/webinar-testing-cars-that-dont-exist-yet-extending-the-automotive-software-factory-with-virtual-ecus/
LOCATION:Online
ATTACH;FMTTYPE=image/jpeg:https://semiwiki.com/wp-content/uploads/2026/09/Markus-Helmling.jpg
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