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DTSTART;VALUE=DATE:20260927
DTEND;VALUE=DATE:20261003
DTSTAMP:20260824T081206Z
CREATED:20260824T081206Z
LAST-MODIFIED:20260824T081206Z
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SUMMARY:ICSCRM 2026
DESCRIPTION:On behalf of the organizing committee\, it is my great honor and pleasure to welcome you to Yokohama\, Japan\, for the 23rd International Conference on Silicon Carbide and Related Materials (ICSCRM 2026)\, September 27－October 2\, 2026. \nThe ICSCRM conference series is the premier international forum focusing on all aspects of silicon carbide and related materials. With the goal of achieving carbon neutrality through significant energy savings\, the importance of low-loss power devices using silicon carbide and related materials is increasing. Currently\, efforts are being made to enhance the materials\, improve the performance and reliability of the devices\, and increase productivity to expand practical applications. Ongoing work to develop implementation and circuit technologies to fully utilize the device performance also continues. In the basic research field\, new developments such as applications in harsh environments and quantum sensing are underway. \nIn this context\, we have planned ICSCRM 2026 to bring researchers and engineers together to exchange the latest research and development results and share information on state-of-the-art technologies and products in the field of silicon carbide and related materials. We also hope to create opportunities for international exchanges among researchers and engineers in this field. Your attendance in scientific discussions and technical exhibitions will enhance the outcome of ICSCRM 2026 and create further steps for the future. \nOnce again\, we welcome all presenters\, participants\, exhibitors\, and sponsors to ICSCRM 2026 and hope all attendants enjoy the conference. \nSincerely\, \n\nHidekazu Tsuchida (CRIEPI)\nGeneral Chair\, ICSCRM 2026 \nScope\nThe aim of this conference is to discuss recent advances in crystal growth\, characterization\, control of material properties\, device fabrication and packaging technologies\, system applications as well as quantum applications concerning silicon carbide (SiC) and related materials including nitride-\, oxide- and diamond-based materials. \nIn addition\, it will discuss latest research results in device design\, fabrication\, characterization\, packaging\, and system applications to improve device performance and reliability\, and address to contribute the realization of cutting edge devices and systems for green innovation. \nThe conference also serves as an international forum for the exchange of ideas on recent scientific and technical issues among researchers and engineers in industrial\, academic and public sectors. \nThe scope of this conference covers the following topics on silicon carbide and related materials\, including other wide bandgap (WBG) semiconductors such as III-nitrides\, oxides\, and diamond. \nTopics\n\nMaterial and Growth\nBulk and epitaxial growth\, Wafer manufacturing \nDefects and Characterization\nFundamental properties\, Point and extended defects\, Characterization and imaging techniques\, Surface characterization and modification \nDevice Process and Characterization\nMOS interface and insulators\, Device fabrication processes (e.g. Implantation\, Oxidation\, Surface treatments\, Metallization\, Ohmic and Schottky contact formations\, and Dry etching technologies) \nDevice Physics\, Design\, and Characterization\nDevice design and testing\, Novel device concepts and Characterization\, Modelling and Simulation\, Novel measurements techniques \nDevices and Module Reliability\, Packaging\, and Applications\nModular and driver-circuit technologies\, System applications\, Packaging and device reliabilities \nQuantum Applications and Sensors\nTheoretical and experimental studies\, Optical and electrical quantum techniques\, for Magnetic\, Electric field\, and Temperature sensors\, Single-photon sources and detectors \n\nfor SiC and related materials including other wide bandgap semiconductors such as III-nitrides\, oxides\, and diamond. \nREGISTER HERE
URL:https://semiwiki.com/event/icscrm-2026/
LOCATION:PACIFICO Yokohama NORTH\, 1 Chome-1-2 Minatomirai\, Yokohama\, Kanagawa\, 220-0012\, Japan
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20260928
DTEND;VALUE=DATE:20261002
DTSTAMP:20260616T211452Z
CREATED:20260616T211452Z
LAST-MODIFIED:20260616T211452Z
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SUMMARY:IMAPS Symposium 2026
DESCRIPTION:The 59th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society and held in Boston\, Massachusetts. IMAPS Symposium offers one of the most robust programs for microelectronics and advanced packaging technical content. Each year\, we welcome many repeat attendees as well as hundreds of first-time visitors – early career packaging professionals\, those new to the industry\, and students. \nREGISTER HERE
URL:https://semiwiki.com/event/imaps-symposium-2026/
LOCATION:Encore Boston Harbor Hotel\, Encore Boston Harbor Hotel\, 1 Broadway\, Everett\, MA\, 02149\, United States
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20260928
DTEND;VALUE=DATE:20261003
DTSTAMP:20260922T044843Z
CREATED:20260922T044843Z
LAST-MODIFIED:20260922T044843Z
UID:373877-1790553600-1790985599@semiwiki.com
SUMMARY:RADECS (RADiation and its Effects on Components and Systems Conference) 2026
DESCRIPTION:What is RADECS?\n\n\n\n\nRADECS (RADiation and its Effects on Components and Systems Conference) is the annual international scientific and industrial forum on radiation and its effects on electronics and photonic materials\, devices\, circuits\, sensors and systems. It is organized every year in a European venue and attracts hundreds of scientists and engineers from all over the world who exchange on the latest advances and results about: \n· Basic Mechanisms of Radiation Effects \n· Radiation Effects in Devices and Integrated Circuits: \no Total Ionizing Dose (TID) \no Total Non-Ionizing Dose (TNID) \no Synergistic Effects \no Single Event Effects (SEE) \n· Radiation Environments \n· Radiation Test Facilities & Dosimetry \n· Radiation Hardening Techniques (Device\, board and system level) \n· Radiation Hardness Assurance \n· Radiation Effects in Photonics\, Optoelectronics and Sensors \n· Radiation Effects in complex devices and systems \nThe 2026 edition of the RADECS Conference will be held on September 28 – October 2. The technical session and the industrial exhibition will take place at the Prague Congress Center. The Thematic Workshop will take place at the historic Bethlehem Chapel. RADECS2026 is organized by the Institute of Experimental and Applied Physics\, CTU in Prague on behalf of the RADECS Association and is technically co-sponsored by the IEEE-NPSS. \nIn addition to the usual RADECS topics\, the 2026 Thematic Workshop is entitled “Measuring to Protect Future Missions: The Critical Role of Detection and Novel Dosimetry in Harsh Radiation Environments”. It explores the full spectrum of space radiation monitoring — from simulation to in-orbit measurements — and highlights the importance of accurate\, real-time detection and advanced dosimetry to inform radiation protection strategies for future missions beyond LEO. With contributions from current missions\, as well as insight into next-generation detectors and onboard processing challenges\, the sessions will foster discussion on what we measure\, how we measure it\, and why it matters\, for a cohesive approach to interpreting space radiation environment. \nWithout forgetting a wonderful social program including technical visits\, tours and social events which will allow the attendees and companions to enjoy Prague and surroundings. \nOn behalf of our committee\, we invite you to join us for an outstanding RADECS 2026 conference and we look forward to meeting you in Prague! \nThe General Chairs (Benedikt Bergmann & Julien Mekki)\,\non behalf of the RADECS 2026 Organizing Committee. \n\n\nREGISTER HERE
URL:https://semiwiki.com/event/radecs-radiation-and-its-effects-on-components-and-systems-conference-2026/
LOCATION:Prague\, Czech Republic\, Prague\, Czech Republic
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20260929
DTEND;VALUE=DATE:20260930
DTSTAMP:20260903T071051Z
CREATED:20260903T071051Z
LAST-MODIFIED:20260903T071051Z
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SUMMARY:TUGx 2026 - Austin\, TX
DESCRIPTION:Teradyne Users Group\n\n\n\n\nTUGx Global Seminars are a series of complimentary\, one-day events hosted in key locations around the world. These seminars are designed to bring together local engineering communities and provide a platform for knowledge sharing and collaboration. By hosting these events globally\, Teradyne ensures that customers everywhere have access to the latest advancements in test technology and methodologies. \nEach seminar is tailored to the needs of its regional audience\, delivering content that is both relevant and actionable. Attendees gain insights into best practices\, innovative test strategies\, and emerging trends that can help them optimize their processes. This localized approach ensures that participants leave with practical solutions and ideas that directly address the challenges they face in their own markets. \nBeyond technical learning\, TUGx Global Seminars foster stronger connections between Teradyne and its customers. These events empower users to maximize the value of their Teradyne technology\, while also creating opportunities for networking and collaboration within the industry. By sharing expertise and encouraging dialogue\, Teradyne helps customers stay ahead in a rapidly evolving test environment. \n\n\nREGISTER HERE
URL:https://semiwiki.com/event/tugx-2026-austin-tx/
LOCATION:Austin\, TX\, Austin\, TX\, United States
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20260929
DTEND;VALUE=DATE:20261001
DTSTAMP:20260915T021742Z
CREATED:20260903T072500Z
LAST-MODIFIED:20260915T021742Z
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SUMMARY:Microelectronics UK
DESCRIPTION:Where the Microelectronics Ecosystem Converges \nSemiconductors • Photonics • Embedded Systems \nConnecting the entire value chain — from R&D to manufacturing\, packaging\, testing and deployment. \nMicroelectronics UK brings together engineers\, technical leaders and technology providers from across the microelectronics ecosystem — spanning semiconductors\, photonics and embedded systems — for two days of technical insight\, collaboration and commercial connection. \nFollowing a strong 2025 edition\, the event showcases the UK’s world-class capabilities in R&D\, design innovation and advanced manufacturing\, while connecting the domestic supply chain with global partners\, policymakers and end-users. \nREGISTER HERE
URL:https://semiwiki.com/event/microelectronics-uk/
LOCATION:ExCeL London\, Royal Victoria Dock\, 1 Western Gateway\, London\, E16 1XL\, United Kingdom
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20260929
DTEND;VALUE=DATE:20261002
DTSTAMP:20260804T044238Z
CREATED:20260804T044213Z
LAST-MODIFIED:20260804T044238Z
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SUMMARY:The AI Conference 2026
DESCRIPTION:About\nShaping the future of AI \nThe AI Conference was founded on a clear belief: AI is not a standalone technology—it is becoming the foundation of modern software\, infrastructure\, and business. \nSince launching in 2023\, the conference has focused relentlessly on applied AI: how AI systems are actually built\, deployed\, governed\, and scaled in the real world. \nWhy\nWhat began as a deeply technical gathering of engineers and researchers has evolved alongside the market. As AI moved from experimentation to enterprise adoption\, The AI Conference expanded to bring together builders\, operators\, executives\, investors\, and policymakers—all with a shared goal of turning AI capability into real impact. \nThe program is designed to reflect how AI is used in practice: \n\nFrontiers explores emerging research and capabilities.\nBuilders focuses on implementation\, infrastructure\, and operations.\nApplied AI showcases production deployments and measurable outcomes.\nStrategy addresses governance\, economics\, and organizational change.\nVertical tracks deliver deep\, industry-specific insight across sectors like healthcare\, finance\, advertising\, and retail.\n\nHands-on workshops\, Hack Day\, and the Startup Showdown ensure the conference is as much about execution as it is about ideas—creating a space where teams build\, companies launch\, and lessons are shared openly. \nREGISTER HERE
URL:https://semiwiki.com/event/the-ai-conference-2026/
LOCATION:Pier 48\, Pier 48\, Shed A and B\, 48 Pier 48\, San Francisco\, CA\, 94158\, United States
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20260929
DTEND;VALUE=DATE:20261003
DTSTAMP:20260921T111638Z
CREATED:20260921T111638Z
LAST-MODIFIED:20260921T111638Z
UID:373773-1790640000-1790985599@semiwiki.com
SUMMARY:PCB West 2026
DESCRIPTION:The Largest Conference and Exhibition for Printed Circuit Board Design\,\nFabrication and Assembly in the Silicon Valley \nRegistration is now live! Click here to secure your spot today! \n\n\n\n\n\n\nFor more than 30 years PCB West has trained designers\, engineers\, fabricators and\, lately\, assemblers on making printed circuit boards for every product or use imaginable. More than 2\,000 designers\, fabricators\, assemblers and engineers register and more than 100 companies exhibit each year at the four-day technical conference and one-day sold-out exhibition. From high-reliability military/aerospace to cutting-edge IoT and wearables\, there’s something for everyone involved in the electronics supply chain. This is one show you cannot afford to miss. \nBrought to you by PCEA: Engineering Tomorrow’s Electronics! \n\n\n\nREGISTER HERE
URL:https://semiwiki.com/event/pcb-west-2026/
LOCATION:Santa Clara Convention Center\, Santa Clara Convention Center\, 5001 Great America Pkwy\, Santa Clara\, CA\, United States
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