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DTSTART;VALUE=DATE:20260823
DTEND;VALUE=DATE:20260827
DTSTAMP:20260804T025224Z
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UID:371910-1787443200-1787788799@semiwiki.com
SUMMARY:Small Satellite Conference
DESCRIPTION:The 40th Annual Small Satellite Conference will spotlight the technologies driving constellation success and celebrate the thousands of people whose vision and collaboration have propelled the industry forward over the past four decades. Join us as we celebrate the past\, examine the present\, and shape the future of small satellites. \n2026 Theme\nThe Clouds Above the Clouds\nCelebrating 40 Years of Collaboration\nOver the past four decades\, the small satellite community has transformed from a dedicated few pioneers working on shoestring budgets into a global ecosystem of commercial\, government\, and academic innovators. This community of collaborators has solved some of the space industry’s most complex challenges\, redefining what’s possible in space. \nToday’s satellite constellations—systems of systems composed of hundreds or even thousands of satellites—collect\, process\, and deliver unprecedented amounts of data with latencies measured in milliseconds. High-speed space networking\, edge processing\, optimized ground infrastructure\, and increased launch opportunities form the foundation of this new era. These “clouds above the clouds” power critical missions in navigation\, Earth and space observation\, communications\, and beyond. \nThe 40th Annual Small Satellite Conference will spotlight the technologies driving constellation success and celebrate the thousands of people whose vision and collaboration have propelled the industry forward over the past four decades. Join us as we celebrate the past\, examine the present\, and shape the future of small satellites. \n\n\n\nREGISTER HERE
URL:https://semiwiki.com/event/small-satellite-conference/
LOCATION:Salt Palace Convention Center\, Salt Palace Convention Center\, 90 S W Temple St\, Salt Lake City\, UT\, 84101\, United States
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2026/08/Screenshot-2026-08-03-195043.png
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DTSTART;VALUE=DATE:20260823
DTEND;VALUE=DATE:20260828
DTSTAMP:20260616T205503Z
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UID:370376-1787443200-1787875199@semiwiki.com
SUMMARY:SPIE Optics + Photonics 2026
DESCRIPTION:Join your colleagues in San Diego for the latest research and insights. \n\nYou’re invited to explore the latest advances and breakthroughs at this dynamic annual conference taking place in beautiful Southern California. Connect with leading researchers and scientists as they share new work in optical engineering\, nanotechnology\, quantum science\, and organic photonics. \nMeet with top suppliers at the free three‑day exhibition \nDiscuss your product needs with top optics and photonics suppliers at the exhibition. \nIndustry partners will be there to help solve problems\, cut costs\, and increase capabilities. \nREGISTER HERE
URL:https://semiwiki.com/event/spie-optics-photonics-2026/
LOCATION:San Diego Convention Center\, San Diego\, CA\, United States
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2026/06/Screenshot-2026-06-16-135428.png
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DTSTART;TZID=America/Los_Angeles:20260826T100000
DTEND;TZID=America/Los_Angeles:20260826T110000
DTSTAMP:20260817T225425Z
CREATED:20260817T225425Z
LAST-MODIFIED:20260817T225425Z
UID:372323-1787738400-1787742000@semiwiki.com
SUMMARY:Webinar: Advanced Packaging at Scale: Power\, Performance\, and Reliability in the Chiplet Era
DESCRIPTION:How Will You Manage Power\, Performance\, and Reliability in the Chiplet Era?\n\nChiplet-based architectures\, 2.5D integration\, and system-in-package (SiP) designs are unlocking new levels of performance\, scalability\, and design flexibility. But moving beyond the monolithic SoC also introduces complex interactions among dies\, interconnects\, substrates\, and packaging\, creating new challenges in power delivery\, thermal management\, mechanical integrity\, test\, and long-term reliability. \nAt the same time\, manufacturers must manage compound yield and rising production costs as the industry progresses from Known-Good-Die (KGD) to increasingly complex multi-die assemblies and Known-Good-Stack (KGS) methodologies. Traditional test and monitoring approaches are no longer enough to provide the visibility needed across die boundaries and throughout the product lifecycle. \nJoin our industry experts for a 40-minute webinar discussion exploring how design\, test\, manufacturing\, and system teams are addressing these challenges through shift-left methodologies\, evolving test standards\, and deeper lifecycle observability and how the semiconductor ecosystem is working to deliver robust\, power-efficient\, and reliable multi-die systems at scale. \nWhat you will learn:\n\nHow emerging standards are enabling more effective test access across complex multi-die systems\nWhy shift-left observability is essential for identifying power\, thermal\, and reliability risks earlier\nHow production test strategies are evolving to address compound yield\, KGD\, and KGS requirements\nHow package-level power delivery and thermal interactions can affect system performance and operating margins\nHow lifecycle monitoring can improve in-field reliability\, optimize performance\, and help extend system lifetime\n\nREGISTER HERE
URL:https://semiwiki.com/event/webinar-advanced-packaging-at-scale-power-performance-and-reliability-in-the-chiplet-era/
LOCATION:Online
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2026/08/Screenshot-2026-08-17-155332.png
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