BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//SemiWiki - ECPv6.15.20//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://semiwiki.com
X-WR-CALDESC:Events for SemiWiki
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Los_Angeles
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20250309T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20251102T090000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20260308T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20261101T090000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20270314T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20271107T090000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260510
DTEND;VALUE=DATE:20260514
DTSTAMP:20260510T200604
CREATED:20260414T060924Z
LAST-MODIFIED:20260414T060924Z
UID:368383-1778371200-1778716799@semiwiki.com
SUMMARY:The 18th IEEE International Memory Workshop
DESCRIPTION:The 18th IEEE International Memory Workshop (IEEE IMW) will be held in 2026 in Leuven\, Belgium. It is currently planned as an on-site event. This conference brings the memory community together in a workshop environment to discuss the memory process and design technologies\, applications\, market needs and strategies. It is sponsored by the IEEE Electron Devices Society and meets annually in May. \nAlthough it is the 18th IMW meeting to be held next year\, it has a long history of Non-Volatile Semiconductor Memory Workshops (NVSMW) dating back to 1976. In 2008\, NVSMW and the International Conference on Memory Technology and Design (ICMTD) merged to incorporate both the volatile and non-volatile memory aspects in one forum while maintaining the workshop experience. And the scope was extended from non-volatile memory technology and design\, which had been successfully discussed in more than 30 years of NVSMW\, to the other memory technologies\, which were the focus of ICMTD. \nThe IEEE IMW is the premier international forum for both new and seasoned technologists having diverse technical backgrounds to share and learn about the latest developments in memory technology with the global community. The scope of workshop content ranges from new memory concepts in early research to the technology drivers currently in volume production as well as emerging technologies in development. The morning and afternoon technical sessions are organized in a manner that provides ample time for informal exchanges amongst presenters and attendees. The evening panel discussions will address hot topics in the memory and memory system field. Papers are solicited in all aspects of semiconductor memory technology (Flash\, DRAM\, SRAM\, PCRAM\, RRAM\, MRAM\, FRAM\, embedded memories\, system\, and emerging memories)\, including but are not limited to: \n\nDevice Physics & Modeling\nCell Design & Novel Materials\nMemory Process & Integration\nCircuit Design\, Algorithms & Error Management\nQuality & Reliability\nSystem Architecture\nNew Concepts & Disruptive Technologies\nEmerging Applications & Markets\nSSD\, Mobile & Automotive Applications\nIn-Memory & Neuromorphic Computing\nMemory-enabled Artificial Intelligence\n\nREGISTER HERE
URL:https://semiwiki.com/event/the-18th-ieee-international-memory-workshop/
LOCATION:Leuven\, Belgium\, Leuven\, Belgium
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2026/04/Screenshot-2026-04-13-230824.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260511
DTEND;VALUE=DATE:20260514
DTSTAMP:20260510T200604
CREATED:20251022T112708Z
LAST-MODIFIED:20251022T112708Z
UID:362937-1778457600-1778716799@semiwiki.com
SUMMARY:Embedded Vision Summit 2026
DESCRIPTION:The premier conference for innovators incorporating computer vision and AI in products\nThe 2025 Summit has now concluded. Join us May 11-13\, 2026!\n\n\nAttend an Immersive Experience\n\n\n\n\nAt the premier conference for innovators incorporating computer vision and AI into products\n\n\n\n\nJoin 1\,400+ product and application developers\, business leaders\, investors and customers—all focused on perceptual AI at the edge. \nSpecial features and Summit themes include:\n\n80+ sessions on embedded vision and deep learning techniques\, technologies\, tools and opportunities\, including formats like: presentations\, case studies and panel discussions\nMultiple expert sessions on deep learning for vision\, 3D perception and low-power vision implementation and much more\nKeynote presentations by industry luminaries\nFour tracks tailored for engineers and business executives\, newcomers and experts\nPractical sessions to help you create visually intelligent products and gain know-how about computer vision\nEdge AI Deep Dive Day filled with in-depth learning from top technology suppliers\nAn intensive three-hour training session designed to introduce the latest techniques in vision-language models (VLMs) and their integration with traditional computer vision methods\nCase studies from leading innovators\nLearn from fast-paced panel discussions presenting an array of viewpoints\nAbility to see technology in action with live demos of the latest enabling technologies and dig deep into the practical applications and techniques of computer vision and AI\n\nREGISTER HERE
URL:https://semiwiki.com/event/embedded-vision-summit-2026/
LOCATION:Santa Clara Convention Center\, Santa Clara Convention Center\, 5001 Great America Pkwy\, Santa Clara\, CA\, United States
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2025/10/TemporaryLogo_2026-01.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260511
DTEND;VALUE=DATE:20260515
DTSTAMP:20260510T200604
CREATED:20250828T055925Z
LAST-MODIFIED:20250828T055925Z
UID:361089-1778457600-1778803199@semiwiki.com
SUMMARY:ASMC 2026
DESCRIPTION:ASMC brings together manufacturers\, equipment and materials suppliers\, and academia to solve manufacturing challenges with innovative strategies and methodologies. \n\n\n\nView the 2025 Agenda\n \nAdvancing Semiconductor Manufacturing Excellence\nASMC is the leading international technical conference for discussing solutions that improve the collective manufacturing expertise of the semiconductor industry. Solving the challenges presented by semiconductor manufacturing is a combined effort by device makers\, equipment and materials suppliers\, and academics. ASMC provides an unparalleled platform for semiconductor professionals to network and learn the latest in the practical application of advanced manufacturing strategies and methodologies. Technical presentations at ASMC highlight industry innovations with specific results and select ASMC manuscripts are published in the ASMC Special Section of IEEE Transactions on Semiconductor Manufacturing. \nThe ASMC Committee is composed of industry professionals representing the microelectronics supply chain. All papers presented at the conference are peer-reviewed by the ASMC Technical Committee. \nWHO SHOULD ATTEND\n\nAcademia\nChief Technology Officers\nFab Managers\nEquipment Manufacturers\nIC Manufacturers\nMaterials Suppliers\nOperations Managers\nProcess Engineers\nProduct Managers\nTechnical Experts\n\n\n\n\nREGISTER HERE
URL:https://semiwiki.com/event/asmc-2026/
LOCATION:Hilton Albany\, 40 Lodge St\, Albany\, NY\, 12207\, United States
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2025/08/Screenshot-2025-08-27-225853.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260512
DTEND;VALUE=DATE:20260513
DTSTAMP:20260510T200604
CREATED:20260122T224315Z
LAST-MODIFIED:20260122T224315Z
UID:366018-1778544000-1778630399@semiwiki.com
SUMMARY:User2User Europe 2026
DESCRIPTION:Join us in Munich where peer-delivered technical sessions were be shared across a breadth of topics so you can explore new concepts or dive deep in your core area of expertise with fellow like-minded professionals. \nSpeaker submissions now open! \nAbout User2User\nThe User2User conference is your opportunity to learn\, grow and connect with fellow technical experts who design leading-edge products using Siemens electronic design automation (EDA) tools. \nWhat to expect?\nThe Siemens User2User conference provides a dedicated environment for exchanging ideas\, information and best practices that enable you to lead in your role and achieve success with your customers. \n\nTechnical agenda concentrated on the digital future\nIndustry leaders exploring macro trends and innovation\nSuper users sharing business challenges and roadblocks\nCase studies demonstrating business results\nNetworking with like-minded peers in EDA\n\nREGISTER HERE
URL:https://semiwiki.com/event/user2user-europe-2026/
LOCATION:Munich\, Germany
ATTACH;FMTTYPE=image/avif:https://semiwiki.com/wp-content/uploads/2026/01/siemens-user2user-conference-2023-04-13-1539.avif
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260512
DTEND;VALUE=DATE:20260513
DTSTAMP:20260510T200604
CREATED:20260414T055909Z
LAST-MODIFIED:20260414T055909Z
UID:368368-1778544000-1778630399@semiwiki.com
SUMMARY:CadenceCONNECT: Tech Days Europe 2026 - Edinburgh
DESCRIPTION:Join us at CadenceCONNECT: Tech Days Europe 2026\, our annual\, free\, multi-track event dedicated to the engineers\, innovators\, and visionaries shaping the future of electronic design. Our aim is to bring together like minded thinkers to explore how AI-driven Cadence technologies are transforming design workflows\, boosting productivity\, and enabling breakthroughs across every domain. \nEvent Details\n\n\n\n06 May 2026 – 30 Jun 2026 \nVarious \nREGISTER HERE
URL:https://semiwiki.com/event/cadenceconnect-tech-days-europe-2026-edinburgh/
LOCATION:Edinburgh\, Scotland\, Edinburgh\, Scotland\, United Kingdom
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2026/04/Screenshot-2026-04-13-225642.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260512
DTEND;VALUE=DATE:20260514
DTSTAMP:20260510T200604
CREATED:20260122T224617Z
LAST-MODIFIED:20260122T224617Z
UID:366021-1778544000-1778716799@semiwiki.com
SUMMARY:ChipEx2026
DESCRIPTION:The major annual event of the Israeli semiconductor industry \nChipEx2026\, the largest annual event of the Israeli semiconductor industry\, will be held on May 12-13\, 2026 in Tel Aviv\, Israel. ChipEx2026 showcases companies including manufacturers\, developers and suppliers of advanced hardware technologies & services. It also includes a technical seminar where the world’s leading experts address the industry’s most relevant issues. \nThe event is produced by ASG Ltd. in cooperation with SIA\, Semiconductor Industry Association and with Semi\, the largest global industry association. \nThe goal of ChipEx2026 is to update all professionals involved with the Israeli semiconductor industry with the latest technological innovations and future directions of the industry. \nChipEx2026 target audience are all people involved with the semiconductor industry including engineers\, R&D managers\, industry experts\, senior executives in microelectronics related companies\, multinational design centers\, consultants\, venture capital managers as well as electrical/electronic/computer science students & professors from the various universities around Israel. \nChipEx2026 consists of three main parts: \nVendors’ Exhibition \nThe ChipEx exhibition includes booths in various sizes for presentations and demonstrations of new design and development tools. This year\, the ChipEx2026 exhibition will take place on May 12\, 2026 at the Tel-Aviv Expo Center and will include industry vendors\, service providers\, and manufacturers of electronic design tools\, components and manufacturing equipment from Israel and around the globe. These exhibitors will exhibit and update the visitors with the latest developments in tools and services for the semiconductor industry. \nTechnical Seminar \nTechnical lectures given by industry experts\, senior executives from the semiconductor industry\, vendors\, and university professors. The format of the sessions intends to cultivate and promote an instructive and productive interchange of ideas and solutions among industry developers and designers. The lectures are divided to various tracks in separate halls and address the major topics related to the microelectronics industry. This year\, the ChipEx2026 technical seminar will take place on May 12\, 2026 at the Tel-Aviv Expo Center. \nChipEx2026 Executive Summit \nThe Clossing session of ChipEx2026 will take place on May 13\, 2026 at Peres Center for Peace and Innovation and will include top industry figures and will act as the Executive summit of ChipEx2026 targeting Industry leaders and top executives from Israel and around the globe. \nChipEx2026 is a great opportunity for any industry vendor or service provider to meet its target audience as well as interact with the decision makers in the various Israeli semiconductor companies. \nWe invite you to take part in ChipEx2026 as an exhibitor\, a speaker and/or as a sponsor. \nFor more details please contact us at:\nPhone: +972-9-7454007\nFax: +972-9-7748858\ninfo@chiportal.co.il\nwww.chipex.co.il \nREGISTER HERE
URL:https://semiwiki.com/event/chipex2026/
LOCATION:Tel Aviv\, Israel\, Tel Aviv\, Israel
ATTACH;FMTTYPE=image/png:https://semiwiki.com/wp-content/uploads/2026/01/Screenshot-2026-01-22-144538.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260512T090000
DTEND;TZID=America/Los_Angeles:20260512T100000
DTSTAMP:20260510T200604
CREATED:20260429T073138Z
LAST-MODIFIED:20260429T073138Z
UID:368915-1778576400-1778580000@semiwiki.com
SUMMARY:Webinar: Intel: Enabling and Evaluating Intel EMIB-T Bridging Design with Synopsys Tools
DESCRIPTION:In this webinar\, Intel will present how EMIB-T (Embedded Multi-die Interconnect Bridge with TSVs) enables compact\, cost-effective multi‑die design while sustaining the bandwidth and power efficiency required for AI and datacenter designs. Intel will share a production-oriented EMIB-T reference methodology built on Synopsys’ 3DIC Compiler platform that spans early planning through signoff. The webinar highlights how early bump and TSV planning\, automated die‑to‑die routing for HBM and UCIe\, and a unified exploration‑to-signoff data model help Intel manage system‑level co-design complexity while maintaining closure on timing\, power\, thermal\, and SIPI. Intel will also discuss SIPI methodology using Synopsys Tools and EMIB-T’s ability to support dense\, high-speed HBM interfaces. \nWhat you’ll learn\n\nHow EMIB-T addresses key multi-die design challenges\nWhy early bump/TSV planning is critical for EMIB‑T success\nHow automated die-to‑die routing accelerates convergence\nHow a unified flow supports scalable timing\, power\, thermal\, and SIPI signoff\nHow EMIB‑T enables high‑speed HBM integration with confidence\n\nREGISTER HERE
URL:https://semiwiki.com/event/webinar-intel-enabling-and-evaluating-intel-emib-t-bridging-design-with-synopsys-tools/
LOCATION:This course will be held Online
ATTACH;FMTTYPE=image/jpeg:https://semiwiki.com/wp-content/uploads/2026/04/synopsys-intel-webinar-1200x1200-2.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260512T130000
DTEND;TZID=America/Los_Angeles:20260512T170000
DTSTAMP:20260510T200604
CREATED:20260429T074239Z
LAST-MODIFIED:20260429T074239Z
UID:368923-1778590800-1778605200@semiwiki.com
SUMMARY:RISC-V Now! by Andes Beijing
DESCRIPTION:RISC-V Now! by Andes is the conference focused on turning RISC-V standards into products that ship — where spec goes to scale. \nIt brings together customers\, ecosystem partners\, and teams evaluating RISC-V for silicon\, software\, and system integration to share real-world experience deploying RISC-V at commercial scale. \nFrom AI and automotive to datacenter and IoT\, RISC-V Now! goes beyond standards discussions to address the realities of execution: architecture decisions\, software enablement\, system integration\, and business outcomes. \nWhether you’re a silicon architect\, software architect\, or CXO\, RISC-V Now! delivers practical insight\, hard-earned lessons\, and actionable perspective on building successful RISC-V products. \n\nREGISTER HERE
URL:https://semiwiki.com/event/risc-v-now-by-andes-beijing/
LOCATION:Park Plaza Beijing Science Park\, Park Plaza Beijing Science Park\, 25 Zhichun Rd\, Beijing\, Haidian District\, China
ATTACH;FMTTYPE=image/webp:https://semiwiki.com/wp-content/uploads/2026/04/2026-RISC-V-Now-Key-Visual_Beijing-1-1.webp
END:VEVENT
END:VCALENDAR