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DTSTART;VALUE=DATE:20260426
DTEND;VALUE=DATE:20260502
DTSTAMP:20260419T111113
CREATED:20260107T101053Z
LAST-MODIFIED:20260107T101053Z
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SUMMARY:2026 MRS Spring Meeting & Exhibit
DESCRIPTION:The 2026 MRS Spring Meeting & Exhibit\, taking place April 26–May 1 in Honolulu\, Hawai‘i\, will convene materials researchers from academia\, industry\, government and national laboratories together for a week of cross-disciplinary collaboration and scientific exchange. Set against the backdrop of one of MRS’s most inspiring locations\, the Meeting & Exhibit will feature breakthroughs in areas such as sustainable manufacturing\, advanced characterization and energy materials—driving forward innovation on a global scale. \nBuilding on this inspiring setting\, the Meeting will span four official venues in Honolulu. Technical programming\, events and accommodations will be distributed within the city’s walkable\, picturesque layout\, creating a dynamic\, interconnected format that will support active engagement and collaboration while maintaining a focused environment for research and application dialogue throughout the Meeting week. \nWhether you’re looking to present new research\, explore emerging technologies\, or engage with peers across disciplines\, the 2026 MRS Spring Meeting will provide an unforgettable experience in an extraordinary location. \nREGISTER HERE
URL:https://semiwiki.com/event/2026-mrs-spring-meeting-exhibit/
LOCATION:Honolulu\, Hawaii\, Honolulu\, HI\, United States
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DTSTART;VALUE=DATE:20260429
DTEND;VALUE=DATE:20260501
DTSTAMP:20260419T111113
CREATED:20260107T101637Z
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SUMMARY:SEMIEXPO Heartland
DESCRIPTION:FOCUSED ON SMART MANUFACTURING & SMART MOBILITY\n\n\nDRIVING SEMICONDUCTOR BUSINESS IN THE MIDWEST \nThank you for being part of the launch of SEMIEXPO Heartland—where Smart Manufacturing and Smart Mobility came together like never before! This groundbreaking event opened new opportunities for collaboration and growth\, driving us toward the semiconductor industry’s $1T future. \nWith so much innovation concentrated in the Midwest\, SEMIEXPO Heartland is just getting started. Stay tuned for our next chapter in Spring 2026—we’ll see you in Detroit\, MI! Get ready for even more inspiration\, insights\, and connections at the intersection of two critical markets. \nMAKE AN IMPACT AT THE INAUGURAL SEMIEXPO HEARTLAND \nPlan Now to Exhibit or Sponsor. Contact—\nShane Poblete | +1 202-847-5983 | spoblete@semi.org \n\n\n\n\n2025 Post Show Report\n\n\n\n\n\n\n\nAnalytics & Statistics\nAttendee Demographics\nKeynotes\nProgram Highlights\nAnd more!\n\n\n\n\n\n\n\nREGISTER HERE
URL:https://semiwiki.com/event/semiexpo-heartland/
LOCATION:Detroit Marriott at the Renaissance Center\, 400 Renaissance Dr W\, Detroit\, MI\, 48243\, United States
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DTSTART;TZID=America/Los_Angeles:20260430T090000
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CREATED:20260408T195314Z
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UID:368236-1777539600-1777543200@semiwiki.com
SUMMARY:Webinar: Powering 3D Multi-Die Designs with RedHawk-SC Electrothermal
DESCRIPTION:As semiconductors continue to scale\, designers are turning to 3DIC architectures to meet increasing demands for performance\, energy efficiency\, and functional density in data centers and edge AI applications. However\, stacking multiple dies introduces new multiphysics challenges including electrical\, structural\, and thermal issues. Join this webinar to learn how RedHawk-SC Electrothermal enables designers to analyze the multiphysics behavior of chips all at once in complex multi-die designs. \nTogether\, Synopsys and Ansys\, part of Synopsys\, provide engineers a comprehensive flow that offers in-design analysis along with final signoff\, enabling faster and more confident development of next-generation multi-die designs. \nAttend this webinar to:  \n\nEnhance your understanding of RedHawk-SC Electrothermal as a foundry-certified multiphysics integrity tool for multi-die designs\nLearn about new features and flow capabilities for 2.5D/3D thermal and mechanical analysis\, including GPU acceleration and ML-based solver\nIntegration of multiphysics simulation in Synopsys implementation and signoff solutions\n\n\n\n\n\nFeatured Speaker\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nDr. Lang Lin \nProduct Management\, Principal \nDr. Lang Lin\, Product Management\, Principal \nBio: Dr. Lang Lin is a technology leader at Synopsys Inc.\, where he directs product strategy for EDA solutions that ensure the multiphysics integrity\, reliability\, and security of advanced IC and multi die systems. With a Ph.D. in Electrical and Computer Engineering from the University of Massachusetts\, his background spans low power design\, multi-die design\, and hardware security—areas that continue to influence his work at the intersection of multiphysics modeling and secure silicon design. Dr. Lin has co authored over 40 papers and patents\, and his work has been recognized with top honors including IEEE HOST Best Paper Award\, IEEE DAC Best Paper Award\, and the Ansys CEO Innovation Award. He worked for Intel and Ansys before his product management role at Synopsys. \nProfile: Lang Lin | Synopsys \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nREGISTER HERE
URL:https://semiwiki.com/event/webinar-powering-3d-multi-die-designs-with-redhawk-sc-electrothermal/
LOCATION:Online
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