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DTSTART;VALUE=DATE:20260302
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SUMMARY:Semitracks Course: Failure and Yield Analysis
DESCRIPTION:Failure and Yield Analysis is an increasingly difficult and complex process. Today\, engineers are required to locate defects on complex integrated circuits. In many ways\, this is akin to locating a needle in a haystack\, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of disciplines in order to effectively perform failure analysis. This requires knowledge of subjects like: design\, testing\, technology\, processing\, materials science\, chemistry\, and even optics! Failed devices and low yields can lead to customer returns and idle manufacturing lines that can cost a company millions of dollars a day. Your industry needs competent analysts to help solve these problems. Failure and Yield Analysis is a 4-day course that offers detailed instruction on a variety of effective tools\, as well as the overall process flow for locating and characterizing the defect responsible for the failure. This course is designed for every manager\, engineer\, and technician working in the semiconductor field\, using semiconductor components or supplying tools to the industry. \nBy focusing on a Do It Right the First Time approach to the analysis\, participants will learn the appropriate methodology to successfully locate defects\, characterize them\, and determine the root cause of failure. \n\n\nWhat Will I Learn By Taking This Class?\nParticipants will learn to develop the skills to determine what tools and techniques should be applied\, and when they should be applied. This skill-building series is divided into three segments: \n\nThe Process of Failure and Yield Analysis. Participants will learn to recognize correct philosophical principles that lead to a successful analysis. This includes concepts like destructive vs. non-destructive techniques\, fast techniques vs. brute force techniques\, and correct verification.\nThe Tools and Techniques. Participants will learn the strengths and weaknesses of a variety of tools used for analysis\, including electrical testing techniques\, package analysis tools\, light emission\, electron beam tools\, optical beam tools\, decapping and sample preparation\, and surface science tools.\nCase Histories. Participants will identify how to use their knowledge through the case histories. They will learn to identify key pieces of information that allow them to determine the possible cause of failure and how to proceed.\n\n\n\n\n\nCourse Objectives\n\nThis course will provide participants with an in-depth understanding of the tools\, techniques and processes used in failure and yield analysis.\nParticipants will be able to determine how to proceed with a submitted request for analysis\, ensuring that the analysis is done with the greatest probability of success.\nThis course will identify the advantages and disadvantages of a wide variety of tools and techniques that are used for failure and yield analysis.\nThis course will offer a wide variety of video demonstrations of analysis techniques\, so the analyst can get an understanding of the types of results they might expect to see with their equipment.\nParticipants will be able to identify basic technology features on semiconductor devices.\nParticipants will be able to identify a variety of different failure mechanisms and how they manifest themselves.\nParticipants will be able to identify appropriate tools to purchase when starting or expanding a laboratory.\n\n\n\nREGISTER HERE
URL:https://semiwiki.com/event/semitracks-course-failure-and-yield-analysis-2/
LOCATION:Munich\, Germany\, Munich\, Germany
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ORGANIZER;CN="Semitracks%2C Inc.":MAILTO:info@semitracks.com
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CREATED:20250828T050601Z
LAST-MODIFIED:20251218T210957Z
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SUMMARY:DVCON U.S. 2026
DESCRIPTION:DVCon is the premier conference on the application of languages\, tools\, and methodologies for the design and verification of electronic systems and integrated circuits. The focus of the conference is the usage of specialized design and verification languages such as SystemVerilog\, Verilog\, VHDL\, PSS\, SystemC and e\, as well as general purpose languages such as C\, C++\, Python\, PERL and Tcl. Tools and methodologies include the use of artificial intelligence\, machine learning\, open-source software\, hardware and architecture\, testbench automation\, hardware-assisted verification\, hardware/software co-verification\, formal verification\, functional safety and security\, transaction-level system design\, high level synthesis\, low power design techniques\, 3D chip designs\, IP-based SoC design methods\, reference flows and Mixed Signal design and verification. \nREGISTER HERE
URL:https://semiwiki.com/event/dvcon-u-s-2026/
LOCATION:Hyatt Regency Hotel\, Santa Clara\, CA\, Santa Clara\, CA\, United States
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DTSTART;VALUE=DATE:20260302
DTEND;VALUE=DATE:20260306
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LAST-MODIFIED:20251211T212817Z
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SUMMARY:MWC 2026
DESCRIPTION:Making way for The IQ Era\n\nMuch can happen in a year within our ecosystem of innovation and connectivity. As we build on the success of MWC25 and engage with MWC26 to activate a new theme – The IQ Era – the world is already shifting to greater heights of digital awareness. \nIn this new age of intelligence\, the way to a better future is through smarter connection: human ideas leading technology\, commercial impact and societal progress. MWC is where leaders of nations\, business and technology assemble\, and collective knowledge collaborates – make your insight count in The IQ Era. \nWhy attend MWC Barcelona?\nFrom eye-opening innovation to mind-expanding ideas\, global policy to lasting partnerships\, it all starts here. Whether you’re a key player in the connectivity ecosystem\, adjacent industries or the wider world of tech\, you’ll find all you need and more at MWC. \n\nREGISTER HERE
URL:https://semiwiki.com/event/mwc-2026/
LOCATION:Fira Gran Via\, Barcelona\, Fira Gran Via\, Av. Joan Carles I\, 64\, Barcelona\, 08908\, Spain
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SUMMARY:22nd Annual Device Packaging Conference (DPC 2026)
DESCRIPTION:The 22nd Annual Device Packaging Conference (DPC 2026) will be held in Phoenix\, Arizona\, on March 2-5\, 2026. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical\, social and networking opportunities for meeting leading experts in these fields. People who will benefit from this conference include: scientists\, process engineers\, product engineers\, manufacturing engineers\, professors\, students\, business managers\, and sales & marketing professionals. The 2026 conference will feature 4 keynote presentations\, an embedded Global Business Council Plenary Session\, an interactive poster session\, an evening panel discussion\, and more. \nREGISTER HERE
URL:https://semiwiki.com/event/22nd-annual-device-packaging-conference-dpc-2026/
LOCATION:Sheraton Grand at Wild Horse Pass\, Sheraton Grand at Wild Horse Pass\, 5594 W Wild Horse Pass Blvd.\, Phoenix\, AZ\, 85226\, United States
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