ECTC is now a Free Virtual Conference
Due to Covid-19 the 70th ECTC is now a virtual event with no registration fee. Enjoy over 400 on demand presentation on the latest packaging technologies. Do not miss Dr Doug Yu of TSMC keynote presentation.
Due to Covid-19 the 70th ECTC is now a virtual event with no registration fee. Enjoy over 400 on demand presentation on the latest packaging technologies. Do not miss Dr Doug Yu of TSMC keynote presentation.
Webinar Series Webinars are chosen during registration Reduce Iterations, Achieve Faster Design Closure Time with Innovus Implementation and Tempus ECO Option Wednesday, July 1, 2020 15:00 UKT / 16:00 CEST …
Continue reading "Webinar Series: Digital Implementation and Signoff"
In the emerging era of large scale SoCs comprised from complex IP, typically designed for AI and automotive applications, designers must embrace an innovative approach to overcome numerous safety and …
Continue reading "In-System Safety and Reliability for Automotive SoCs using Innovative Memory IP"
Overview The increased analog content of today’s ICs needs more automation and reuse during the custom layout process. These circuits frequently use structures requiring precise matching of device characteristics. Module …
Continue reading "Webinar: Improve Device Matching with Assisted Component P&R"