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Webinar: Foundations and Integrations of Ansys EMA3D Tools Part 2: EMC

September 22 @ 8:00 AM - 9:00 AM

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This webinar, the second in a 3-part series, we’ll consider the means of using EMA3D electromagnetic simulation tools for EMC. The special capabilities of EMA3D tools will be brought to bear on electronics designs, in conjunction with the use of other Ansys tools to collaboratively optimize EMC for full systems.

TIME:

SEPTEMBER 22, 2022

11 AM EDT / 4 PM BST / 8:30 PM IST

About This Webinar

Part two of this 3-part series examines EMA3D electromagnetic simulation tools for EMC (electromagnetic certification) design projects. The growth in electrification of consumer, industrial and military/aerospace products & systems has led design teams to protect embedded electronics systems against hazards such as ESD (electrostatic discharge) and EMI (electromagnetic interference.) Product developers increasingly turn to simulation tools to capture potential electromagnetic risks earlier in the design process.

This webinar considers the numerical methods, solver technologies, and special features of EMA3D electromagnetic simulation tools, which lend themselves to EMC design considerations in an electronic device and system development. We’ll also elaborate on the integrations between EMA3D and other Ansys tools, which generate improved EMC modeling, superior simulation accuracy, design optimization, and model-based system engineering (MBSE).

What You Will Learn

  • Full wave electromagnetic co-simulation using finite difference time domain (FDTD) solutions along with multiconductor transmission line (MTL) theory
  •  How fields are exchanged between the two solvers and application to EMC design efforts
  • Grid-based FDTD mesh technologies. We describe how EMA3D® goes beyond volumetric voxels to include surfaces and lines
  • Describe sub-cell simulation techniques and details
  • How FDTD, MTL, and transient circuit solvers can all three be co-simulated to solve relevant problems in EMC
  • Fluid and electromagnetic co-simulation, platform integration, optimization, and collaboration

Speakers

Tim Mcdonald

Tim McDonald

Tim McDonald is the President and Co-Owner of Electro Magnetic Applications. He implemented new system-modeling approaches to simulate the interaction of systems and their electronics with electromagnetic environments in a shorter time, with more accuracy, and at a lower cost. He’s a consultant to NASA and Department of Defense major contractors for specialty engineering of critical systems, development of novel nanomaterial solutions to EMI/EMC problems, and execution of major programs that require verification of electromagnetic environmental effects.

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Details

Date:
September 22
Time:
8:00 AM - 9:00 AM
Event Tags:
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Website:
https://www.ansys.com/webinars/foundations-and-integrations-of-ansys-ema3d-tools-part-2-emc

Organizer

Ansys
View Organizer Website

Venue

Online