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VLSI Design/CAD Symposium 2022
August 2, 2022 - August 5, 2022
Sincerely welcome everyone to participate in the 33rd Seminar on Ultra Large Integrated Circuit Design and Computer Aided Design Technology in 2022. The conference will last for four days from August 2 to August 5. It was originally scheduled to be held at Kaohsiung E-Da Royal Hotel. Due to the outbreak of the new crown Omicron epidemic, the conference was held online in consideration of the health and safety of the guests. However, in the speech part of the conference, a small number of audiences will be allowed to enter Hsinchu Tsinghua University depending on the epidemic situation. The live broadcast of the university hopes to add a feeling of live interaction between people in a mixed form.
The theme of this conference is “Post Pandemic VLSI Design/CAD”. It is hoped that through four days of specially invited speeches, keynote discussions, short courses and paper publications, the conference will discuss the challenges faced by integrated circuit design and computer-aided design after the epidemic. The new challenge is to gather the wisdom of all parties, encourage each other to innovate, and promote the exchange of people from all walks of life, including industry, government, academia, and research, and create a new peak in electronic technology research and industrial development.
In the Keynote section of this conference, Dean Lin Benjian, School of Semiconductor Research, Tsinghua University, was invited to give a speech on the theme of “IC Design to Take Advantage of Ultimate Lithography”; and Professor Su Chaoqin of Yangming Jiaotong University, winner of this year’s Professor Shen Wenren Memorial Award, was invited to give a speech on the theme of “IC Design to Take Advantage of Ultimate Lithography”. “A high-tech engineer’s formula for success” was the subject of his speech. He also invited Director Ding Bangan of the Institute of Information Technology, Industrial Technology Research Institute, to give a presentation on “Opportunities and Challenges of Taiwan’s Industrial Chain from the Development of Low-Earth Orbit Satellite Technology” in view of the international popular communication technologies in recent years. . In the keynote speech section, Yang Qingsong, Executive Vice President of Entropy Code Technology, was invited to deliver “Ensuring Security of Application & Service with Chip Fingerprint” on the issue of chip information security. Professor Xiang Ziyuan, Department of Sports and Athletics, National Taiwan Normal University was also invited. , for the popular application field in recent years, “Sports Technology”, to express his experience and opinions; also invited Song Bo’an, general manager of Yihua Computer Taiwan, to publish “Semiconductor EDA Revolution – Smart System Drives the Future of the Electronics Industry”. Wonderful speech, please wait and see.
During the four-day session, in addition to the above-mentioned agenda, the conference also planned activities such as Graduate Student Forum, microelectronics results publication, TSRI Special Session & Short Course, Industrial Session, online exhibitors’ company product information display and manufacturer live broadcasts. , hoping to enhance the interaction and exchange between industry and academia, and provide a platform for the industry to recruit elite talents from various schools.
This conference can be successfully held, especially thanks to Yihua Technology, TSMC, MediaTek, One Element Technology, Qijing Optoelectronics, AMD/Xilinx, Compal Computer, Google, Hecheng Technology, Yuanxiang Technology, Realtek Semiconductor, Taiwan New Think Technology, Haodesheng Technology and many other manufacturers have sponsored and enthusiastically participated. At the same time, I would like to thank the Information and Technology Education Department of the Ministry of Education, the Engineering Technology Promotion Center of the Engineering Department of the Ministry of Science and Technology, the Taiwan Semiconductor Research Center of the National Research Institute, the Industrial Technology Research Institute of the Consortium Corporation, Guidance and assistance from the government and research units such as the Institute of Information Science, Academia Sinica, the Information Technology Innovation Center of the Academia Sinica, the Smart Chip System Integration Promotion Alliance, and the MediaTek-Tsingda Innovation Research Center.
Finally, I would like to thank all the teachers, colleagues and assistants of the National Tsing Hua University Integrated Circuit Design Technology R&D Center who participated in the preparations for the conference, as well as the TICD Board of Supervisors, the Conference Steering Committee, the agenda members, the distinguished guests who were invited to give speeches, and the industry leaders who attended the conference. Every guest! I wish the conference a successful and successful meeting, and I wish everyone good health and safety.
The 33rd Symposium on Ultra-Large Integrated Circuit Design and Computer Aided Design Technology
The chairman of the conference, Ma Xibin