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This Is Not Your Father’s Semiconductor Packaging: An EDA Perspective
June 17, 2020
Semiconductor foundries are accelerating their offerings for advanced packaging. This sea change in the advanced packaging market brings several important new solutions to the industry as well as significant design and analysis challenges for the packaging engineer. Many packaging professionals are becoming aware that the typical design flows used today for BGA packages have gaping holes when targeting the newer 2.5D-/3D-IC packaging technologies. Get an overview of the trends and advancements for foundry-based 2.5D-IC, 3D-IC, and FOWLP solutions.
Learn about the challenges and benefits of the modernized design flow for foundry-based packagingShare this post via: