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SEMI Pacific Northwest Forum
November 3, 2022 @ 8:00 AM - 12:00 PM
The Future of More Than Moore—Chiplets, Advanced Packaging, and More
November 3, 2022
8:00am-12:00pm PT
Biamp
BEC Auditorium
Presented by the SEMI
Pacific Northwest and Silicon Valley Chapters
How can we extend Moore’s Law and drive new capabilities in the More than Moore era? The answer lies in the technology, economics, and new opportunities in the semiconductor supply chain.
Join us at the Forum on Thursday, November 3, 2022, 8–11:30am Pacific Time to hear industry experts explore the Future of More Than Moore. The event is In-Person, Virtual, and On-Demand for your convenience.
Speakers
ASE
Mark Gerber
Sr. Director, Engineering & Technical Marketing
Advanced Packaging: Enabling a New Generation of Silicon Systems
FORMFACTOR
Amy Leong
SVP, CMO, GM Emerging Growth/M&A
Strategy for Wafer Probe in a Chiplet World
GARTNER
Bob Johnson
Vice President,
Analyst
Semiconductor Market Outlook: Change in the Midst of Uncertainty
Martin Dixon
Director of
Engineering
[KEYNOTE] Open Chiplets to Enable a New Era of Silicon
INTEL CORPORATION
Martha Dudek, PhD
Sr. Director, Assembly Materials Global Supply Chain
[KEYNOTE] Material Supply Chain Innovations for Advanced Packaging
BIAMP SYSTEMS
Joe Andrulis
Executive Vice President,
Corporate Development
[HOST] Welcome &
Tour of Biamp
China’s hoard of chip-making tools: national treasures or expensive spare parts?