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SEMI Pacific Northwest Forum

November 3 @ 8:00 AM - 12:00 PM

1 SEMI November 3 2022 300x300

The Future of More Than Moore—Chiplets, Advanced Packaging, and More

November 3, 2022
8:00am-12:00pm PT
Biamp
BEC Auditorium

REGISTER HERE

SEMI, November 3, 2022

Presented by the SEMI
Pacific Northwest and Silicon Valley Chapters

How can we extend Moore’s Law and drive new capabilities in the More than Moore era? The answer lies in the technology, economics, and new opportunities in the semiconductor supply chain.

Join us at the Forum on Thursday, November 3, 2022, 8–11:30am Pacific Time to hear industry experts explore the Future of More Than Moore. The event is In-Person, Virtual, and On-Demand for your convenience.

Speakers

ASE

Mark Gerber
Sr. Director, Engineering & Technical Marketing

Advanced Packaging: Enabling a New Generation of Silicon Systems

FORMFACTOR

Amy Leong
SVP, CMO, GM Emerging Growth/M&A

Strategy for Wafer Probe in a Chiplet World

GARTNER

Bob Johnson
Vice President,
Analyst

Semiconductor Market Outlook: Change in the Midst of Uncertainty

GOOGLE

Martin Dixon
Director of
Engineering

[KEYNOTE] Open Chiplets to Enable a New Era of Silicon

INTEL CORPORATION

Martha Dudek, PhD
Sr. Director, Assembly Materials Global Supply Chain

[KEYNOTE] Material Supply Chain Innovations for Advanced Packaging

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