
IMAPS Symposium 2023
October 2 - October 5
The 56th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society ((IMAPS and held in San Diego, California at the Town & Country Resort.
This year’s program will feature 5 technical tracks, plus our Interactive Poster Session. The technical program will span three days of sessions with emphasis on SiP/Design/Manufacturing Optimization; Wafer Level/Panel Level (Advanced RDL); High Performance/High Reliability; Advanced Package (Flip Chip, 2.5D, 3D, Optical); Advanced Process & Materials (Enabling Technology).
About IMAPS
Welcome to the International Microelectronics and Packaging Society, the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. Worldwide, IMAPS offers educational and networking opportunities for industry professionals, packaging organizations, and students through technical conferences and workshops, professional development courses, IMAPSource microelectronics packaging research library, and local chapters. Exhibitions market the latest product and service applications of the current technology.
The Society covers a wide-range of technologies and topics critical to microelectronics assembly and packaging, including: on-shoring, heterogeneous integration, fan-out wafer level packaging, 2.5D/3D technologies, system-in-package, photonics/optical, power packaging, CPI, package design/modeling, interconnects, wire bonding, flip chip, MEMS, sensors, packaging for 5g/6g, RF/wireless, signal/power integrity, advanced materials, substrates and more.
IMAPS memberships are available for Corporations, Individuals and Students and provide many valuable benefits: technical, educational and speaking opportunities, networking, event discounts, and the Advancing Microelectronics magazine. For corporations: branding, press releases, discounted advertising, Jobs Marketplace, company listing in Industry Guide, and more.
History
Founded in 1967 as ISHM, then merging with the International Electronic and Packaging Society (IEPS) in 1996, the Society has over 50 years of networking, education, and publication history.
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