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IC Packaging Design and Modeling

October 10 @ 8:00 AM - October 13 @ 12:00 PM

$600

IC Packaging Design and Modeling

IC packaging complexity levels are rising year-by-year in lock step with process advances and electrical performance enhancements. Single die packages with leads have given way to multi-chip area array packages, stacked die packages, and stacked packages. Pin-counts have increased from a few handfuls to thousands. Space constraints for consumer products have required shrinking some packages to barely larger than the chip volume, and high-performance applications have required ever increasing levels of power dissipation and higher frequency operation. Pin count increases alone driven by wide I/O have driven substrate technologies to include upwards of 20 or 30 interconnect layers. Higher integration levels in automotive applications have motivated higher reliability requirements. At the same time, time-to-market and cost reduction requirements have forced an ever-accelerating product development pace where missing a product launch can spell a company’s doom. Trial and error iteration won’t work in today’s industry.

The only way to meet the interrelated demands of complexity, performance, time-to-market, and reliability is through appropriate package design processes and modeling. This two-day class will cover fundamental issues in package design, including the need for appropriate risk analysis, up-front design rules, early look-ahead, and modeling coupled with verification. Participants will learn the fundamentals of thermal and electrical analysis for performance characterization. Compact models that enable transferring phenomenological behavior between die, package, and system level models will be described. Mechanical analysis examples applied to a wide range of reliability issues will be emphasized with a focus on solving issues in advance. Participants will learn the critical factors that must be implemented to ensure the success of their package designs and products.

To sign up for this webinar, please visit us at IC Packaging Design and Modeling | Semitracks

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Details

Start:
October 10 @ 8:00 AM
End:
October 13 @ 12:00 PM
Cost:
$600
Website:
Semitracks.com

Organizer

Semitracks, Inc.
Phone:
505-858-0454
Email:
info@semitracks.com
View Organizer Website