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Electronics Design for Manufacturability (DfM): Avoiding Failure After Reflow

June 18, 2020 @ 11:00 AM - 12:00 PM

June 18, 2020

11:00 AM (EDT)


In the electronics industry, the capability of manufacturing suppliers greatly impacts the quality and reliability of any product. Manufacturing issues are one of the top reasons that companies fail to meet warranty expectations. Both process and design can play critical roles during manufacturing, while design for manufacturability (DfM) typically remains overlooked in the design process. Many manufacturing and assembly-related issues can be avoided with a proactive DfM approach.

Join us for this free webinar, in which we’ll review several considerations for electronics DfM. A variety of examples will be presented including general guidelines, physical examples, as well as simulation. Leveraging simulation can help predict and avoid loads that cause printed circuit board assembly (PCBA) issues such as component cracking, pad cratering, or solder fracture. An Ansys Sherlock workflow will be presented to highlight how simulation can be used to evaluate post-soldering manufacturing and assembly processes.

  • Receive expert tips for implementing DfM within your organization.
  • Understand how you can use simulation to help forecast and prevent loads that create PCBA issues.
  • Discover how you can leverage Sherlock to help measure post-soldering manufacturing and assembly processes.
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