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Electronic and photonic building blocks for high-speed wireline transceivers

March 31, 2022 @ 8:00 AM - 10:30 AM

Simon Stanley 105x105
Date / Time: Thursday, March 31, 2022, 11:00 a.m. New York / 4:00 p.m. London


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Especially inside the large data centers that underpin today’s cloud and internet infrastructure, traffic keeps growing exponentially. As a result, the industry is now looking at 800G- and even 1.6T-capable optical (pluggable) transceivers, and co-packaged optics with even higher capacities. Maintaining transceiver footprints requires significant advances in terms of energy efficiency, integration density and bandwidth of both the electronic and photonic components of next-gen wireline transceivers.

Topics that will be addressed during this webinar include:

  • The use of SiGe BiCMOS to achieve beyond 100Gbaud operation as a more accessible alternative to compound semiconductors in analog electronic integrated circuits such as drivers and receivers.
  • The move towards 5- and even 3nm CMOS for next-generation ADCs and DACs.
  • Novel approaches for dense integration of electronic and photonic components with unprecedented integration density and manufacturing scalability.
  • Moving functionality from the electronic to the optical domain using new schemes such as optical domain equalizers.
Simon Stanley, Analyst at Large, Heavy Reading | bio Peter Ossieur, Program Manager – high-speed transceivers, imec | bio
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