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Electronic and photonic building blocks for high-speed wireline transceivers
March 31 @ 8:00 AM - 10:30 AM
Especially inside the large data centers that underpin today’s cloud and internet infrastructure, traffic keeps growing exponentially. As a result, the industry is now looking at 800G- and even 1.6T-capable optical (pluggable) transceivers, and co-packaged optics with even higher capacities. Maintaining transceiver footprints requires significant advances in terms of energy efficiency, integration density and bandwidth of both the electronic and photonic components of next-gen wireline transceivers.
Topics that will be addressed during this webinar include:
- The use of SiGe BiCMOS to achieve beyond 100Gbaud operation as a more accessible alternative to compound semiconductors in analog electronic integrated circuits such as drivers and receivers.
- The move towards 5- and even 3nm CMOS for next-generation ADCs and DACs.
- Novel approaches for dense integration of electronic and photonic components with unprecedented integration density and manufacturing scalability.
- Moving functionality from the electronic to the optical domain using new schemes such as optical domain equalizers.