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CadenceLIVE 2022 – Silicon Valley – Abstract Submission
June 8, 2022 - June 9, 2022
June 8-9, 2022
Are you driving design change or feel you’ve overcome challenges that could impact the electronic revolution? CadenceLIVE offers you an opportunity to tell your story. Showcase your expertise and offer tips to address complexities and challenges facing engineers today.
CadenceLIVE Silicon Valley 2022 will be held on June 8-9 at the Santa Clara Convention Center. It features peer presentations that offer solutions for today’s design challenges that will impact tomorrow’s products.
We are seeking presentations that illustrate your experiences with Cadence® products, solutions, flows, methodologies, and techniques in the following areas:
Applications
- 5G/RF/Communications
- Automotive
- Advanced Node
- Cloud
- Artificial Intelligence and Machine Learning
- IP
- Other (i.e. Aerospace & Defense, Marine, Turbomachinery, Healthcare, IoT)
Solutions for:
- Systems Design Analysis
- Computational Fluid Dynamics
- Custom IC / Mixed Signal / RF
- Digital Design & Signoff
- 3D-IC
- PCB / Advanced Packaging
- Verification (HW & SW)
Submit an abstract for consideration and if it is accepted, you’ll gain free admittance to the in-person conference.
Abstract submissions should be no more than 2,500 characters, clearly stating the significant contribution, impact, and results of the submission. All abstracts will be reviewed. Authors of accepted presentations must sign a copyright release form for their presentation. Notice of acceptance will be sent via email. View examples of last year’s presentations .
Should you have any questions about abstract submissions, please email cadencelive@cadence.com.
China’s hoard of chip-making tools: national treasures or expensive spare parts?