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February 7, 2019

Join EDA Direct’s webinar on Thermal Analysis to predict, optimize, and solve thermal issues in Electronic Systems using FloTHERM from 10 am – 11 am
The costs of product failures due to thermal issues can be significant if found late in the design or prototyping stage. This requires applying good design practices for thermal management of electronics products during development. CFD analysis for electronics cooling can predict airflow and temperature of electronic components earlier to ensure reliable performance in the field.

We will discuss and show how to build a thermal analysis model of an electronics PCB board within an electronics enclosure for thermal analysis. A cooling scenario will then be solved and results analyzed. Valuable information such as airflow patterns, pressure drops, and temperature distributions on the board and components will be extracted and reviewed. By use of Thermal analysis results, we will then look at evaluating design changes and optimizing the design to improve critical component temperatures within the system.

What You Will Learn

  • How to build a thermal analysis model of a product and review of electronics cooling challenges for different scenarios
  • How to solve and analyze the results including transient analysis.
  • How to extract valuable information such as airflow pattern, pressure drop and temperature distribution
  • How to optimize the design to maintain operating temperature for critical component using Parametric Analysis


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February 7, 2019