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Advanced Semiconductor Technology Conference (ASTC) 2022 (Singapore)

January 13, 2022 - January 14, 2022

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9:00 am – 5:00 pm


PARKROYAL COLLECTION Marina Bay (formerly Marina Mandarin)
6 Raffles Boulevard, Marina Square

Advanced Semiconductor Technology Conference (ASTC) Hybrid Second Edition is back on 13-14 January 2022 with the theme “Future of Innovative Packaging & Test Methodologies”.

Semiconductor packaging is increasingly driving chip innovation, and heterogeneous integration is at the forefront of these technological advances that are increasing the complexity of semiconductor design and testing. To help overcome this challenge, chip designers are deploying cutting-edge technologies such as big data and artificial intelligence (AI) to make testing more efficient and effective.

Join us at ASTC 2022 as we cover the following tracks:

Track 1: Advanced Packaging & Heterogeneous Integration
Theme: Transformation of Heterogeneous Integration in Advanced Packaging

Heterogeneous Integration combines components into a single package to meet the demand for greater IC performance and functionality driven by digital transformation technologies such as AI, IoT, smart devices, 5G, data analytics, autonomous vehicles. These market trends are transforming Heterogeneous Integration from standard SMT to advanced packaging in order to meet the miniaturization, manufacturability and cost requirements of various applications. New innovations in assembly, test and materials are key to meeting these requirements. Industry leaders will share the latest advanced packaging requirements, innovations and roadblocks to advance heterogeneous integration.

Track 2: Test and Yield Analysis
Theme: Adopting Artificial Intelligence in Next-Generation Test and Yield

The growing sophistication of silicon technology and design is increasing the complexity of defect modes, driving demand for more elaborate testing and test flows to meet new standards for product quality. This trend also presents new opportunities to innovate leveraging leading-edge technologies such as big data analytics, AI and machine learning to make testing more efficient and effective. This forum will explore the next generation of innovations, 5G wireless test challenges and the new RITdb (Rich Interactive Test database) datalogging standard.

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Who should Attend

  • Leadership and technical engineering professionals in the microelectronics and semiconductor industries
  • Academics and higher learning research institutions
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January 13, 2022
January 14, 2022
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