Loading Events

« All Events

  • This event has passed.

2021 IEDM Call for Papers

July 23

The Annual International Electron Devices Meeting
will be held at the Hilton San Francisco Union Square
San Francisco, CA, December 11-15, 2021.

 

Abstract Deadline : July 23, 2021

The paper submission deadline is July 23 for submission of four-page, camera-ready papers to provide faster dissemination of the conference’s cutting-edge results. Accepted papers will be published as-is in the proceedings.

ADVANCED LOGIC TECHNOLOGY (ALT)

Typical Themes

  • CMOS platform technologies & opportunities
  • Logic device performance and circuit design challenges
  • Advanced, novel process integration schemes and (applications-driven) scaling approaches
  • Process module innovations and progresses in process control & process metrology
  • Device technology co-optimization (DTCO)

New or Trending Areas

  • Si1-xGex channels, GAA (vertically stacked) nanowires and nanosheets based devices and circuits
  • Sequential, monolithic 3D integration, heterogenous chiplets, 2.5/3D integration
  • Interconnects (TSV, BEOL, Frontside and Backside connectivity)
  • BEOL compatible transistors

EMERGING DEVICE and COMPUTE TECHNOLOGY (EDT)

Typical Themes

  • 2D and devices on low-dimensional materials
  • Neuromorphic and approximate computing devices
  • Spintronic and magnetic devices
  • Steep-slope devices
  • Quantum computing devices

New or Trending Areas

  • Topological materials and devices, and phase transitions transistors
  • Emerging state machines, continuous time dynamical systems
  • Novel LT/Cryogenic Devices

MEMORY TECHNOLOGY (MT)

Typical Themes

  • Conventional memories
  • Emerging memories
  • 3D memory technologies
  • Computing-in-memory

New or Trending Areas

  • Emerging memories for neural networks
  • Memory-enabled artificial intelligence applications
  • Memory for bio-inspired computing
  • System-technology co-optimization
  • New Memory hierarchy

MICROWAVE, MILLIMETER WAVE and ANALOG TECHNOLOGY (MAT)

Typical Themes

  • High Performance III-V, III-Nitride and Si, SiGe devices for mm-wave to THz.
  • Power device technologies for micro and mm-wave.
  • Micro and mm-wave analog front ends, PAs, LNAs and mixers.
  • Energy harvesting devices and circuits
  • Tunable passives, SAW/BAW devices, antenna arrays

New or Trending Areas

  • Device and circuits for 5G and 6G
  • Antenna arrays and beam forming
  • Control electronics for Quantum Computing
  • Cryogenic RF devices

MODELING AND SIMULATION (MS)

Typical Themes

  • Technology CAD and benchmarking
  • Atomistic process and device simulation
  • Compact models for DTCO and STCO
  • Alternative computing device modeling
  • Material and interconnect modeling

New or Trending Areas

  • Multiscale simulation with hybrid techniques
  • Advanced packaging and 3D integration modeling
  • Device modeling for photonic
  • Devices/modeling for in-sensor computing

OPTOELECTRONICS, DISPLAYS, and IMAGING SYSTEMS (ODI)

Typical Themes

  • Heterogeneous optoelectronic integration including sources, modulators or detectors
  • Optoelectronic integration for neuromorphic computing
  • Single photon devices
  • Luminescent devices based on new materials including perovskites and quantum dots
  • Displays and imagers for augmented or virtual reality
  • Holographic devices and displays
  • Displays with unconventional form or size
  • Photodetectors and imagers with new materials or flexible platform and printed electronics
  • Imagers with unconventional spectral bandwidth, high sensitivity, or high time-resolution

New or Trending Areas

  • Topological optoelectronics and photonics
  • Intelligent Image Sensors
  • In-display Sensors

POWER DEVICES and SYSTEMS (PDS)

Typical Themes

  • Power devices, modules and systems
  • System-level impact of power devices
  • Manufacturing processes, device design, modeling, physics, and reliability of power devices
  • Fundamental studies on doping, traps, interface states and device reliability for power switching devices

New or Trending Areas

  • Wide bandgap and ultra-wide bandgap semiconductors
  • Power device for applications for automotive and aviation to smart grid
  • Power devices or circuits and its reliability

RELIABILITY OF SYSTEMS and DEVICES (RSD)

Typical Themes

  • Reliability of FEOL/MEOL/BEOL, latch‐up and ESD;
  • Design for reliability and variability-aware design,
  • Robustness and security of electronic circuits and systems.
  • Reliability of devices and systems for biomedical, automotive and aerospace
  • Reliable systems with unreliable devices
  • Reliability of cryogenic devices for future quantum computing applications
  • Noise characterization

New or Trending Areas

  • Degradation mechanisms of emerging memories
  • Reliability of devices, circuits and systems for more-than-Moore
  • Reliability of biomedical devices, circuits and systems
  • Reliability of automotive and aerospace devices circuits and systems

SENSORS, MEMS, and BIOELECTRONICS (SMB)

Typical Themes

  • Physical and biochemical integrated sensors
  • Energy harvesting and storage devices
  • Flexible devices for wearable applications
  • MEMS for Internet of Things
  • Bio-electronic interfaces and implantable devices

New or Trending Areas

  • Intelligent sensors with embedded AI
  • Sensors and devices for human-machine interface
  • Hybrid organic/inorganic microfabrication and devices
  • Sensors and motors for haptics
Share this post via:

Details

Date:
July 23
Event Tags:
,
View Event Website

Venue

No Venue