2021 IEDM Call for Papers

Typical Themes

• CMOS platform technologies & opportunities
• Logic device performance and circuit design challenges
• Advanced, novel process integration schemes and (applications-driven) scaling approaches
• Process module innovations and progresses in process control & process metrology
• Device technology co-optimization (DTCO)

New or Trending Areas

• Si1-xGex channels, GAA (vertically stacked) nanowires and nanosheets based devices and circuits
• Sequential, monolithic 3D integration, heterogenous chiplets, 2.5/3D integration
• Interconnects (TSV, BEOL, Frontside and Backside connectivity)
• BEOL compatible transistors

Typical Themes

• 2D and devices on low-dimensional materials
• Neuromorphic and approximate computing devices
• Spintronic and magnetic devices
• Steep-slope devices
• Quantum computing devices

New or Trending Areas

• Topological materials and devices, and phase transitions transistors
• Emerging state machines, continuous time dynamical systems
• Novel LT/Cryogenic Devices

Typical Themes

• Conventional memories
• Emerging memories
• 3D memory technologies
• Computing-in-memory

New or Trending Areas

• Emerging memories for neural networks
• Memory-enabled artificial intelligence applications
• Memory for bio-inspired computing
• System-technology co-optimization
• New Memory hierarchy

Typical Themes

• High Performance III-V, III-Nitride and Si, SiGe devices for mm-wave to THz.
• Power device technologies for micro and mm-wave.
• Micro and mm-wave analog front ends, PAs, LNAs and mixers.
• Energy harvesting devices and circuits
• Tunable passives, SAW/BAW devices, antenna arrays

New or Trending Areas

• Device and circuits for 5G and 6G
• Antenna arrays and beam forming
• Control electronics for Quantum Computing
• Cryogenic RF devices

Typical Themes

• Technology CAD and benchmarking
• Atomistic process and device simulation
• Compact models for DTCO and STCO
• Alternative computing device modeling
• Material and interconnect modeling

New or Trending Areas

• Multiscale simulation with hybrid techniques
• Advanced packaging and 3D integration modeling
• Device modeling for photonic
• Devices/modeling for in-sensor computing

Typical Themes

• Heterogeneous optoelectronic integration including sources, modulators or detectors
• Optoelectronic integration for neuromorphic computing
• Single photon devices
• Luminescent devices based on new materials including perovskites and quantum dots
• Displays and imagers for augmented or virtual reality
• Holographic devices and displays
• Displays with unconventional form or size
• Photodetectors and imagers with new materials or flexible platform and printed electronics
• Imagers with unconventional spectral bandwidth, high sensitivity, or high time-resolution

New or Trending Areas

• Topological optoelectronics and photonics
• Intelligent Image Sensors
• In-display Sensors

Typical Themes

• Power devices, modules and systems
• System-level impact of power devices
• Manufacturing processes, device design, modeling, physics, and reliability of power devices
• Fundamental studies on doping, traps, interface states and device reliability for power switching devices

New or Trending Areas

• Wide bandgap and ultra-wide bandgap semiconductors
• Power device for applications for automotive and aviation to smart grid
• Power devices or circuits and its reliability

Typical Themes

• Reliability of FEOL/MEOL/BEOL, latch‐up and ESD;
• Design for reliability and variability-aware design,
• Robustness and security of electronic circuits and systems.
• Reliability of devices and systems for biomedical, automotive and aerospace
• Reliable systems with unreliable devices
• Reliability of cryogenic devices for future quantum computing applications
• Noise characterization

New or Trending Areas

• Degradation mechanisms of emerging memories
• Reliability of devices, circuits and systems for more-than-Moore
• Reliability of biomedical devices, circuits and systems
• Reliability of automotive and aerospace devices circuits and systems

Typical Themes

• Physical and biochemical integrated sensors
• Energy harvesting and storage devices
• Flexible devices for wearable applications
• MEMS for Internet of Things
• Bio-electronic interfaces and implantable devices

New or Trending Areas

• Intelligent sensors with embedded AI
• Sensors and devices for human-machine interface
• Hybrid organic/inorganic microfabrication and devices
• Sensors and motors for haptics