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Good news in a way: Merrill Lynch (or Bank of America Merrill Lynch as I suppose we have to get used to calling them) have re-started coverage of EDA with a 20 page report on the industry, much of which is spent on explaining how the industry segments out and who is strong in which segments, stuff that most people reading this site already… Read More
I attended the 3D architectures for semiconductor integration and packaging conference just before Christmas. I learned a lot and have put together an overview of what is going on in 3D ICs. This is not intended for experts (and if I’ve made egregious errors then please correct them in the forum) but more for people who are … Read More
At the EDAC CEO panel, Daniel pointed out that he used EDA360 as a good introduction to non-specialists (e.g. financial sector). I just discovered today that the cover article of PC Today is by John Bruggeman (well, Cadence) about EDA360. Having some idea of just how difficult it is to get that sort of specialist article into a general… Read More
Solidohas run an interesting survey on variation-aware design. The data is generic and not specific to Solido’s products although you won’t be surprised to know that they have tools in this area.
What is variation-aware design? Semiconductor manufacturing is a statistical process and there are two ways to handle this in the design… Read More
One of the important but often unrecognized aspects of engineering is re-building the infrastructure underneath key design tools. Sometimes this gives a new desirable capability but often a lot of the effort is simply to modernize the code base so that it is possible to continue development effectively going forward. For example,… Read More
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Missed deadlines and tension among Taiwanese and American coworkers are plaguing the chip giant’s Phoenix expans
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