Lithography For Advanced Packaging Equipment

Lithography For Advanced Packaging Equipment
by Robert Castellano on 06-24-2019 at 10:00 am

Advanced IC packaging, such as fan-out WLP (Wafer Level Packaging) and 2.5D TSV (Through Silicon Via) will drive the packaging equipment market, particularly lithography. This will help specific equipment manufacturers in 2019, since the WFE (Wafer Front End) market will drop 17%. But the Back-End lithography market, led … Read More


1971 is the year that Intel changed the world

1971 is the year that Intel changed the world
by Daniel Nenni on 06-24-2019 at 5:00 am

The “20 Questions with John East” series continues

From time to time I present the History of Silicon Valley as I saw it to various audiences.  I always enjoy doing that.  I’ve learned that the part that audiences like the most is the Apple / Steve Jobs story.  That’s not hard to understand.  Steve Jobs was truly fascinating! The story… Read More


FPGA Prototyping for AI Product Development

FPGA Prototyping for AI Product Development
by Randy Smith on 06-21-2019 at 8:00 am

I recently wrote about The Implications of the Rise of AI/ML in the Cloud. In that article, I wrote about my expectation that the rapidly growing AI market will lead to the accelerated use of high-level synthesis (HLS), prototyping, and emulation. In this article, I will focus on the prototyping portion of that – specifically FPGA… Read More


#56thDAC Discussion on Calibre in the Cloud Brings Sunshine to SOC Developers

#56thDAC Discussion on Calibre in the Cloud Brings Sunshine to SOC Developers
by Tom Simon on 06-20-2019 at 10:00 am

It was inevitable that EDA applications would meet the cloud. EDA has a long history of creating some of the most daunting compute challenges. This arises from employing current generation chips to design the next generation chips. Despite growing design complexity, many tools have kept pace and even reduced runtimes from generation… Read More


ARM Spins New IP for Client Applications

ARM Spins New IP for Client Applications
by Bernard Murphy on 06-20-2019 at 5:00 am

Arm is a machine. They crank out new products in a wide range of categories, Project Trillium for AI, Neoverse for infrastructure, their Automotive Enhanced line and the Pelion IoT platform. And in each they have a regular beat of new product introductions following roadmaps they have already laid out. Not that you’d expect any … Read More


SiP is the new SoC @ 56thDAC

SiP is the new SoC @ 56thDAC
by Tom Dillinger on 06-19-2019 at 6:48 pm

The emergence of 3D packaging technology has been accompanied by the term “more than Moore”, to reflect the increase in areal circuit density at a rate that exceeds the traditional IC scaling pace associated with Moore’s Law.  At the recent Design Automation Conference in Las Vegas, numerous exhibits on the vendor floor presented… Read More


#56DAC – Functional Safety Panel hosted by Mentor

#56DAC – Functional Safety Panel hosted by Mentor
by Daniel Payne on 06-19-2019 at 5:28 pm

Four experts in the discipline of functional safety were gathered together at #56DAC in Vegas earlier in June, hosted at the Mentor booth, so I rested my legs and typed notes as fast as I could. The product areas that I first think about when functional safety (FuSa) comes up are automotive, medical and aerospace, because keeping… Read More


Meet the Experts @ ES Design West!

Meet the Experts @ ES Design West!
by Daniel Nenni on 06-18-2019 at 10:00 am

SEMICON West and ES Design West are right around the corner here in San Francisco and I wanted to point out the Meet the Experts segment in the appropriately named Meet the Experts Theater. Great idea really and a super great line-up. The best part of course is actually meeting the experts. Over my 35 year semiconductor career I have… Read More


Synopsys Low Power Workshop Offers Breadth and Depth

Synopsys Low Power Workshop Offers Breadth and Depth
by Bernard Murphy on 06-18-2019 at 5:00 am

Synopsys seems to particularly excel at these events, whether in half-day tutorials at conferences or, as in this case, in a full-day on-site workshop. You might think there’s not much that can be added in this domain, other than to bring low-power newbies up to speed, but you’d be wrong. This event set the stage with surveys on needs… Read More


An Update from Joe Sawicki @ Mentor, a Siemens Business 56thDAC

An Update from Joe Sawicki @ Mentor, a Siemens Business 56thDAC
by Tom Dillinger on 06-17-2019 at 10:22 pm

Executives from the major EDA companies attend the Design Automation Conference to introduce new product features, describe new initiatives and collaborations, meet with customers, and participate in lively conference panel discussions.  Daniel Nenni and I were fortunate to be able to meet with Joe Sawicki, Executive Vice… Read More